公开(公告)号：US20210359187A1

公开(公告)日：2021-11-18

申请号：US17318146

申请日：2021-05-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changhoon KWAK ,  Moonsub KIM ,  Seokman CHO ,  Myoungsun HA ,  Sujong HAN

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/48 ,  H01L33/38

Abstract: A light emitting device substrate includes an insulating layer, a plurality of upper pads spaced apart from each other in a matrix pattern on the insulating layer, a first circuit pattern inside the insulating layer, the first circuit pattern electrically connecting some of the plurality of upper pads to each other, a second circuit pattern inside the insulating layer, the second circuit pattern being under the first circuit pattern and electrically connected to the first circuit pattern, and a plurality of lower pads spaced apart from each other under the insulating layer, a number of the plurality of lower pads being smaller than a number of the plurality of upper pads, and at least one of the plurality of lower pads being electrically connected to two or more upper pads of the plurality of upper pads via the first circuit pattern and the second circuit pattern.

公开(公告)号：US20220416130A1

公开(公告)日：2022-12-29

申请号：US17724758

申请日：2022-04-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoungsun HA ,  Hyunju PARK ,  Sunwoo KIM ,  Youngkyung KIM

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/50 ,  H01L25/075

Abstract: A semiconductor light emitting device includes a package body including a concave portion surrounded by sidewalls, a light emitting diode (LED) chip on a mounting surface of the concave portion, a lead frame in the package body and electrically connected to the LED chip, a wavelength conversion layer in the concave portion and surrounding the LED chip, the wavelength conversion layer being surrounded by the sidewalls of the package body and including a wavelength conversion material, and a transparent resin layer on the wavelength conversion layer, the transparent resin layer having first opposite side surfaces exposed through sides of the package body and spaced apart from each other along a first direction parallel to the mounting surface, and second opposite side surfaces contacting an inner surface of the package body and spaced apart from each other in a second direction parallel to the mounting surface.