公开(公告)号：US20240274480A1

公开(公告)日：2024-08-15

申请号：US18472364

申请日：2023-09-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYEON JOON KIM ,  DONGSOO LEE ,  SUNGHYUN KIM

IPC: H01L21/66

CPC classification number: H01L22/34 ,  H01L22/12 ,  H01L22/22

Abstract: A method of operating an electronic device for detecting a defect due to a particle in an equipment generated during a bonding process of a semiconductor chip is disclosed. For example, the method may include obtaining, by the electronic device, profile data including operation information of the equipment from the equipment during the bonding process. Additionally, the method may include calculating, by the electronic device, characteristic data of bonded chips (e.g., from the bonding process) by pre-processing the profile data. Subsequently, after the bonding process is completed, the method may include selecting, by the electronic device, a coordinate of a defective chip on a substrate as a defect coordinate by comparing result data of a reference chip and peripheral chips based on the characteristic data. In some embodiments, the result data may include respective height value information of the bonded chips.