公开(公告)号：US12302052B2

公开(公告)日：2025-05-13

申请号：US18075747

申请日：2022-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongwook Park ,  Yongbum Jeung ,  Seeyoun Kwon ,  Sangwoo Yu ,  Seunga Lee ,  Jeock Lee

IPC: H04R1/10 ,  H04R1/08 ,  H04R1/28

Abstract: An electronic device wearable on a body may include: a first case configured to at least partially contact the body when the electronic device is worn on the body; a second case coupled to the first case, the second case being configured to, at an exposed area on an outer surface of the second case, be exposed when the electronic device is worn on the body; a first acoustic hole configured to penetrate the second case in the exposed area; a second acoustic hole configured to penetrate the second case at a position different from the first acoustic hole; and an acoustic dimple recessed into the outer surface of the second case and extending from the second acoustic hole.

公开(公告)号：US20230095154A1

公开(公告)日：2023-03-30

申请号：US18075747

申请日：2022-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngwook Park ,  Yongbum Jeung ,  Seeyoun Kwon ,  Sangwoo Yu ,  Seunga Lee ,  Jeock Lee

IPC: H04R1/10 ,  H04R1/28 ,  H04R1/08

Abstract: An electronic device wearable on a body may include: a first case configured to at least partially contact the body when the electronic device is worn on the body; a second case coupled to the first case, the second case being configured to, at an exposed area on an outer surface of the second case, be exposed when the electronic device is worn on the body; a first acoustic hole configured to penetrate the second case in the exposed area; a second acoustic hole configured to penetrate the second case at a position different from the first acoustic hole; and an acoustic dimple recessed into the outer surface of the second case and extending from the second acoustic hole.