公开(公告)号：US20230097135A1

公开(公告)日：2023-03-30

申请号：US17939153

申请日：2022-09-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Joo KIM ,  Ye Chan KIM ,  Ju-Young KIM ,  Ji Yup KIM ,  Hyun Woo KIM ,  Ju Hyeon PARK ,  Ji Cheol PARK ,  Hyun Ji SONG ,  Hong Gu IM ,  Suk Koo HONG

IPC: G03F7/004 ,  G03F7/039 ,  G03F7/20

Abstract: An additive for a photoresist, a photoresist composition for a EUV including the same, and a method for manufacturing a semiconductor device using the same, the additive including a copolymer that includes a first repeating unit represented by the following Chemical Formula 1-1, and a second repeating unit represented by the following Chemical Formula 2, wherein a molar ratio of the first repeating unit to the second repeating unit is 7:3 to 2:8,