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公开(公告)号：US20210181267A1
公开(公告)日：2021-06-17
申请号：US17121638
申请日：2020-12-14
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Young Ju LEE , lk Kyu YOU , Jung Jae LEE
Abstract: A micro LED bond tester including a stage configured to mount a circuit board on which micro LEDs are mounted, and a gas blower configured to blow gas into at least one of the micro LEDs on the circuit board.
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