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公开(公告)号：US20230096310A1
公开(公告)日：2023-03-30
申请号：US17952616
申请日：2022-09-26
发明人： Olivier Pamart , Bruno Dupont , Romain Anselmini
摘要： A substrate for contacting an electrical pin arranged in a housing includes a base having a recess receiving the electrical pin, a metal leadframe having a contacting region electrically and/or thermally contacting the electrical pin, and a contact pin extending along a mating direction in a plane parallel to the metal leadframe and configured to electrically contact a mating contact pin of a mating connector. The metal leadframe is rigidly fixed to the base to prevent a relative movement between the metal leadframe and the substrate. The substrate is movable with respect to the housing along a locking direction from an unlocked position where the substrate is not locked to the housing to a locked position in which the substrate is locked to the housing. A movement of the contacting region with respect to the electrical pin is prevented in the locked position.
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公开(公告)号：US11513167B2
公开(公告)日：2022-11-29
申请号：US17012381
申请日：2020-09-04
发明人： Cheolho Lee , Seungjoon Yoon
摘要： An electronic device according to certain embodiments comprises a printed circuit board (PCB); a processor mounted on the PCB; and a connection interface configured to connect the PCB to an off-board electronic component, wherein the processor is configured to: output an inspection signal to the connection interface according to a particular bit pattern at a designated bit rate; identify a voltage level of a reception signal input to the processor, during a designated time, in response to the output of the inspection signal particular bit pattern; and determine a connection state of the connection interface based on the identified voltage level of the reception signal.
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公开(公告)号：US20220214377A1
公开(公告)日：2022-07-07
申请号：US17705639
申请日：2022-03-28
发明人： Changhyun Song , Jaehwan Jeong
摘要： A test device for a high-speed/high-frequency test. The test device includes: a conductive block which includes a probe hole; at least one signal probe which is supported in an inner wall of the probe hole without contact, includes a first end to be in contact with a testing contact point of the object to be tested, and is retractable in a lengthwise direction; and a coaxial cable which includes a core wire to be in electric contact with a second end of the signal probe. With this test device, the coaxial cable is in direct contact with the signal probe, thereby fully blocking out noise in a test circuit board.
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公开(公告)号：US10884075B2
公开(公告)日：2021-01-05
申请号：US16329780
申请日：2018-08-01
发明人： Bing Xu , Tao Hou , Junping Bao , Xinghua Li
摘要： A printed circuit board, a method for determining an engagement state between the printed circuit board and a flexible printed circuit, and a display device are provided. The printed circuit board includes a substrate, a connector fixed on the substrate, and configured to be connected with the flexible printed circuit, and a determining circuit connected with the connector. The secondary pin is added to the connector, and can determine together with the determining circuit, added to the substrate, connected with the secondary pin, an engagement state between the first pins of the connector, and the second pins of the flexible printed circuit.
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5.发明申请公开(公告)号：US20200249283A1
公开(公告)日：2020-08-06
申请号：US16837099
申请日：2020-04-01
发明人： Hee Gwon LEE , Sung Un PARK
摘要： A display device includes a display panel, a conductive layer disposed under the display panel, a first flexible printed circuit board including a first substrate portion having a side connected to the display panel, a bending portion extending from the first substrate portion, and a second substrate portion extending from the bending portion and disposed under the conductive layer. The second substrate portion includes a first sensing pattern. The display device further includes a coupling portion disposed between the second substrate portion and the conductive layer and coupling the second substrate portion and the conductive layer. The display device further includes a driver chip electrically connected to the first sensing pattern and configured to detect whether the coupling portion has been separated from either the second substrate portion or the conductive layer based on a capacitance that depends on a distance between the conductive layer and the first sensing pattern.
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公开(公告)号：US11600806B2
公开(公告)日：2023-03-07
申请号：US17015091
申请日：2020-09-09
发明人： Wei Yu , Junfeng Li , Yuehua Zhang , Zheng Liu , Xiaodong Sun
摘要： The application discloses an auxiliary method and device for one time programmable (OTP) adjustment of a display panel. The auxiliary method includes: crimping and conducting a flexible circuit board to a display panel bonded with a chip by means of pre-bonding, to lead a crimping impedance by the flexible circuit board; detecting the crimping impedance led by the flexible circuit board; and screening a detected crimping impedance value to determine whether the OTP adjustment is enabled, wherein when the crimping impedance value meets a preset condition, the OTP adjustment is enabled, and when the crimping impedance value does not meet the preset condition, the OTP adjustment is disabled.
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公开(公告)号：US11211136B2
公开(公告)日：2021-12-28
申请号：US16453745
申请日：2019-06-26
IPC分类号： G11C29/38 , G11C29/36 , G11C16/04 , G11C16/10 , G11C16/14 , G11C16/26 , G01R31/319 , G11C29/12 , G01R31/70 , G06F11/22 , G01R31/27
摘要： A variety of applications can include systems and methods that include a memory system tester having an analyzer coupled to a test flow controller. The test flow controller can be arranged to generate test signals to a memory system with the analyzer arranged to couple to test pads of a package platform for the memory system. The analyzer can provide data to the test flow controller to conduct testing and/or debugging of the memory system, with the data based on real time monitoring of the test pads of the package platform. In various embodiments, the analyzer can provide data feedback to the test flow controller in real time such that the test flow controller can control the flow of test signals to the memory system in real time. Additional apparatus, systems, and methods are disclosed.
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公开(公告)号：US10938167B2
公开(公告)日：2021-03-02
申请号：US16293536
申请日：2019-03-05
发明人： Michael Gregory German , Ryan E. Enge , Andrew P. Roberts , Matias Peluffo , Masood Shariff , Ernest C Pickens
IPC分类号： H01R13/703 , H04Q1/02 , G01R31/70
摘要： One embodiment is directed to detecting that a cable has been connected to a port of patching equipment and detecting that the cable is no longer connected to said port. In response to detecting that the cable is no longer connected, information associated with fixed cabling coupled to said port that is captured by a cable tester is downloaded to a controller. The downloaded information is associated with said port and the downloaded information and association information is locally stored at the controller. The locally stored information can then be used to create and/or populate objects in a database. Another embodiment is directed to including a storage device and a wireless interface in patching equipment or other equipment such as an outlet or consolidation point for use in writing information to the storage device and reading information from the storage device via the wireless interface. Other embodiments are disclosed.
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公开(公告)号：US20200371154A1
公开(公告)日：2020-11-26
申请号：US16881621
申请日：2020-05-22
发明人： Javier A. DeLaCruz , Belgacem Haba , Guy Regev
摘要： A bonded structure is disclosed. The bonded structure can include a first semiconductor element having a first front side and a first back side opposite the first front side. The bonded structure can include a second semiconductor element having a second front side and a second back side opposite the second front side, the first front side of the first semiconductor element directly bonded to the second front side of the second semiconductor element along a bond interface without an adhesive. The bonded structure can include security circuitry extending across the bond interface, the security circuitry electrically connected to the first and second semiconductor elements
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公开(公告)号：US10746812B2
公开(公告)日：2020-08-18
申请号：US16534522
申请日：2019-08-07
发明人： Kazuo Henmi , Ken Katano
摘要： A semiconductor device includes a semiconductor chip having first, second and third pads, first and second external terminals to which a power supply potential or a reference potential is supplied, first and second wires connecting the first and second external terminals and the first and second pads, and a third wire connecting the second external terminal and the third pad. The semiconductor chip further includes a first internal wiring connected to the first and second pads, a second internal wiring connected to the third pad, and a detection circuit. The detection circuit includes: a current source for passing a current through the first and second internal wirings; first and second resistive elements connected between the current source and the first and second internal wirings; and an amplifier circuit for amplifying a relative potential difference generated between the first and second resistive elements and outputting a detection signal.
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