METHOD FOR COOLING A MOULD BY CIRCULATING A HEAT-TRANSFER FLUID IN CONTACT WITH THE EXTERNAL FACE THEREOF
    1.
    发明申请
    METHOD FOR COOLING A MOULD BY CIRCULATING A HEAT-TRANSFER FLUID IN CONTACT WITH THE EXTERNAL FACE THEREOF 有权
    通过循环传热流体与其外部表面接触来冷却模具的方法

    公开(公告)号:US20140065256A1

    公开(公告)日:2014-03-06

    申请号:US14010783

    申请日:2013-08-27

    Abstract: Method and apparatus for cooling a heated mould (12, 14, 16) of a device (10) for blow-moulding thermoplastic containers, the device including: a mould (12, 14, 16) having an internal face which delimits a moulding cavity (18) and which includes an external face (20, 28) which surrounds the moulding cavity (18); heating elements for heating the mould to a determined temperature and which are deactivated when the cooling method is implemented; characterized in that the mould (12, 14, 16) is cooled by circulating heat-transfer fluid directly in contact with the external face (20, 28) thereof.

    Abstract translation: 用于冷却用于吹塑热塑性容器的装置(10)的加热模具(12,14,16)的方法和装置,所述装置包括:模具(12,14,16),其具有界定模制腔 (18),并且其包括围绕所述模制腔(18)的外表面(20,28); 用于将模具加热到确定的温度的加热元件,并且当实施冷却方法时,其被停用; 其特征在于,所述模具(12,14,16)通过使与所述外表面(20,28)直接接触的传热流体循环来冷却。

    Heating station comprising a laser emitter
    2.
    发明公开

    公开(公告)号:US20240283223A1

    公开(公告)日:2024-08-22

    申请号:US18567767

    申请日:2022-06-09

    CPC classification number: H01S5/423 H01S5/02469 H01S5/042 H01S5/34

    Abstract: A heating station of a container manufacturing installation, the heating station having a plurality of laser emitters wherein each laser emitter includes a plurality of laser chips mounted on an external face of at least one support. In example embodiments, each laser chip includes at least one laser diode arranged to emit laser radiation in the infrared range in an emission direction substantially perpendicular to the external face of the support. In example embodiments, each laser diode includes at least two active regions stacked on one another in the emission direction, wherein each active region participating in the laser radiation emitted by said laser diode.

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