公开(公告)号：US10672689B2

公开(公告)日：2020-06-02

申请号：US16460704

申请日：2019-07-02

Applicant: STMICROELECTRONICS, INC.

Inventor： Frederick Ray Gomez ,  Tito Mangaoang, Jr. ,  Jefferson Talledo

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/60 ,  H01L23/31 ,  H01L23/00 ,  H01L21/66

Abstract: According to principles of the disclosure as explained herein, selected leads are electrically connected through metal strips to the lead frame until the end of the manufacturing process. The lead frame is grounded through the manufacturing process to prevent any ESD event from causing damage to the protected leads. In the final singulation step, the leads are electrically isolated from each other and from the lead frame, thus maintaining protection from a potential ESD event up until the final package singulation step.

公开(公告)号：US10388594B2

公开(公告)日：2019-08-20

申请号：US15636533

申请日：2017-06-28

Applicant: STMICROELECTRONICS, INC.

Inventor： Frederick Ray Gomez ,  Tito Mangaoang, Jr. ,  Jefferson Talledo

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/66 ,  H01L23/00 ,  H01L23/31 ,  H01L23/60 ,  H01L23/495

Abstract: According to principles of the disclosure as explained herein, selected leads are electrically connected through metal strips to the lead frame until the end of the manufacturing process. The lead frame is grounded through the manufacturing process to prevent any ESD event from causing damage to the protected leads. In the final singulation step, the leads are electrically isolated from each other and from the lead frame, thus maintaining protection from a potential ESD event up until the final package singulation step.