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公开(公告)号：US20130079068A1
公开(公告)日：2013-03-28
申请号：US13629872
申请日：2012-09-28
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Romain Coffy , Julien Vittu
CPC classification number: H01L25/167 , G01S7/4813 , G01S17/026 , H01L31/0203 , H01L31/02325 , H01L2224/48227 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
Abstract: A package includes a substrate with an attached emitting IC chip and receiving IC chip. The emitting IC chip includes an optical emitter, and the receiving IC chip includes a main optical sensor and a secondary optical sensor. A case is provided with a bottom portion and a peripheral wall portion to cover the IC chips, wherein the edge of the peripheral wall portion is mounted to the substrate. The bottom portion of the case includes a main opening above the main optical sensor and a secondary opening above the optical emitter. An opaque material is interposed between the case and the receiving IC chip to isolate the main optical sensor from the secondary optical sensor and delimiting a chamber containing the secondary optical sensor and the optical emitter. The chamber is optically isolated from the main optical sensor and main opening, and may be filled with a transparent material.
Abstract translation: 封装包括具有附接的发射IC芯片并接收IC芯片的基板。 发光IC芯片包括光发射器，并且接收IC芯片包括主光学传感器和次级光学传感器。 壳体设置有覆盖IC芯片的底部部分和周壁部分，其中周壁部分的边缘安装到基板。 壳体的底部包括在主光学传感器上方的主开口和在光发射器上方的次级开口。 在外壳和接收IC芯片之间插入不透明材料，以将主光学传感器与次级光学传感器隔离，并且限定包含第二光学传感器和光学发射器的室。 该室与主光学传感器和主开口光学隔离，并且可以填充有透明材料。
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公开(公告)号：US08716739B2
公开(公告)日：2014-05-06
申请号：US13629872
申请日：2012-09-28
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Romain Coffy , Julien Vittu
CPC classification number: H01L25/167 , G01S7/4813 , G01S17/026 , H01L31/0203 , H01L31/02325 , H01L2224/48227 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
Abstract: A package includes a substrate with an attached emitting IC chip and receiving IC chip. The emitting IC chip includes an optical emitter, and the receiving IC chip includes a main optical sensor and a secondary optical sensor. A case is provided with a bottom portion and a peripheral wall portion to cover the IC chips, wherein the edge of the peripheral wall portion is mounted to the substrate. The bottom portion of the case includes a main opening above the main optical sensor and a secondary opening above the optical emitter. An opaque material is interposed between the case and the receiving IC chip to isolate the main optical sensor from the secondary optical sensor and delimiting a chamber containing the secondary optical sensor and the optical emitter. The chamber is optically isolated from the main optical sensor and main opening, and may be filled with a transparent material.
Abstract translation: 封装包括具有附接的发射IC芯片并接收IC芯片的基板。 发光IC芯片包括光发射器，并且接收IC芯片包括主光学传感器和次级光学传感器。 壳体设置有覆盖IC芯片的底部部分和周壁部分，其中周壁部分的边缘安装到基板。 壳体的底部包括在主光学传感器上方的主开口和在光发射器上方的次级开口。 在外壳和接收IC芯片之间插入不透明材料，以将主光学传感器与次级光学传感器隔离，并且限定包含第二光学传感器和光学发射器的室。 该室与主光学传感器和主开口光学隔离，并且可以填充有透明材料。
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