公开(公告)号：US11908968B2

公开(公告)日：2024-02-20

申请号：US17838929

申请日：2022-06-13

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain Coffy ,  Remi Brechignac ,  Jean-Michel Riviere

IPC: H01L31/16 ,  H01L23/00

CPC classification number: H01L31/16 ,  H01L24/73 ,  H01L2224/73265

Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated in a transparent block. An opaque conductive layer is applied to a top surface and a side surface of the transparent block. The receiver is mounted to the opaque conductive layer at the top surface. An electrical connection is made between the receiver and the opaque conductive layer. A conductive strip is also mounted to the side surface of the transparent block and isolated from the opaque conductive layer. A further electrical connection is made between the receiver and the conductive strip.

公开(公告)号：US11740416B2

公开(公告)日：2023-08-29

申请号：US17546314

申请日：2021-12-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain Coffy ,  Jean-Michel Riviere

IPC: G02B6/42

CPC classification number: G02B6/4239 ,  G02B6/4213 ,  G02B6/4274

Abstract: An optoelectronic element is located in a package. The package includes a first optical block and a second optical block that are attached to each other by a bonding layer. One of the first and second optical blocks is attached to lateral walls of the package by glue. The material of the bonding layer is configured to induce less stress to the first and second optical blocks than the glue.

公开(公告)号：US11546059B2

公开(公告)日：2023-01-03

申请号：US17169010

申请日：2021-02-05

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Jean-Michel Riviere ,  Romain Coffy ,  Karine Saxod

IPC: H04B10/40 ,  H05K7/02 ,  H05K5/03 ,  H04B10/80 ,  H01L31/16 ,  H01L31/0203

Abstract: A cover for an electronic circuit package, including: a body having an opening extending therethrough; a first element located in the opening and having a surface continuing planar or rounded shapes of a surface of the cover; and a second element of connection of the first element to the body.

公开(公告)号：US11038595B2

公开(公告)日：2021-06-15

申请号：US16409723

申请日：2019-05-10

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Alexandre Coullomb ,  Romain Coffy ,  Jean-Michel Riviere

IPC: H04B10/40 ,  H01L31/0203 ,  H01L25/04 ,  H04B10/50 ,  H04B10/69

Abstract: An optoelectronic device includes a substrate and a first optoelectronic chip flush with a surface of the substrate. The device includes a cover that covers the substrate and the first optoelectronic chip. The cover comprises a cavity above a first optical transduction region of the first optoelectronic chip. The device also includes a second optoelectronic chip having a second optical transduction region spaced apart from the first optical transduction region and the cavity continues above the second optical transduction region.

公开(公告)号：US10777710B2

公开(公告)日：2020-09-15

申请号：US16432561

申请日：2019-06-05

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Romain Coffy ,  Jean-Michel Riviere

IPC: H01L33/48 ,  H01L33/18 ,  F21V15/01

Abstract: A housing for a light source mounted on a substrate, the housing comprising: a barrel having first and second conducting columns; and a diffuser having a through-hole or partial hole filled with a conductive plug, the conductive plug electrically bridging a gap in an electrical connection between the first and second conducting columns.

公开(公告)号：US10738985B2

公开(公告)日：2020-08-11

申请号：US16439308

申请日：2019-06-12

Applicant: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED ,  STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Joseph Hannan ,  Stuart Robertson ,  Romain Coffy ,  Jean-Michel Riviere

IPC: F21V21/00 ,  F21V23/04 ,  F21V23/00 ,  H01L23/00 ,  F21K9/20 ,  H01L33/44 ,  H05B45/00

Abstract: The disclosure concerns a housing for a light source mounted on a substrate, the housing comprising: a molded body having an opening permitting the passage of a light beam generated by the light source; one or more surfaces for receiving a diffuser; and first and second conducting pins traversing the molded body.

公开(公告)号：US09502361B2

公开(公告)日：2016-11-22

申请号：US14852711

申请日：2015-09-14

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain Coffy ,  Julien Pruvost

IPC: H01L23/488 ,  H01L23/00 ,  B81C3/00 ,  H01L23/31 ,  H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/14 ,  H01L23/498 ,  H01L25/00

CPC classification number: H01L23/562 ,  B81B2207/098 ,  B81C3/001 ,  B81C2201/0174 ,  B81C2203/0771 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/563 ,  H01L23/14 ,  H01L23/3114 ,  H01L23/315 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/564 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2924/15311 ,  H01L2924/18161

Abstract: An electronic device includes a first and a second integrated-circuit chip that are stacked at a distance from one another, and a plurality of electrical connection pillars and at least one protective barrier interposed between the chips. The protective barrier delimits a free space between mutually opposing local regions of the chips, and an encapsulation block extends around the chip that has the smaller mounting face and over the periphery of the mounting face of the other chip. The electrical connection pillars and the protective barrier are made of at least one identical metallic material with a view to simultaneous fabrication.

Abstract translation: 电子设备包括彼此间隔地堆叠的第一和第二集成电路芯片，以及插入在芯片之间的多个电连接柱和至少一个保护屏障。 保护屏障限定了芯片的相互相对的局部区域之间的自由空间，并且封装块围绕具有较小安装面的芯片延伸，并且在另一芯片的安装面的周边上延伸。 电连接柱和保护屏障由至少一种相同的金属材料制成，以同时制造。

公开(公告)号：US09478677B2

公开(公告)日：2016-10-25

申请号：US14723993

申请日：2015-05-28

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Julien Pruvost ,  Romain Coffy

IPC: H01L31/0232 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/02 ,  H01L27/146

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/1464 ,  H01L27/14683 ,  H01L31/02002 ,  H01L31/02327 ,  H01L31/18 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15174 ,  H01L2924/16235

Abstract: An electronic device includes a substrate plate with a traversing passage. An electronic component, mounted to the substrate plate, includes an integrated circuit chip with an optical sensor and an opaque protective plate mounted above the sensor. The electronic component is mounted with the chip facing the substrate plate such that the protective plate is engaged with the traversing passage. Electrical connection elements extend between the chip and the substrate plate. An internal block of encapsulation material extends into the traversing passage of the substrate plate between the chip and the substrate plate so as to embed the electrical connection elements.

Abstract translation: 电子设备包括具有横向通道的基板。 安装到基板的电子部件包括具有安装在传感器上方的光学传感器和不透明保护板的集成电路芯片。 电子部件安装有芯片面向衬底板，使得保护板与横向通道接合。 电连接元件在芯片和基板之间延伸。 封装材料的内部块在芯片和衬底板之间延伸到衬底板的横向通道中，以嵌入电连接元件。

公开(公告)号：US20140206154A1

公开(公告)日：2014-07-24

申请号：US14221921

申请日：2014-03-21

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Romain Coffy ,  Yvon Imbs ,  Laurent Marechal

IPC: H01L21/56

CPC classification number: H01L21/56 ,  H01L21/568 ,  H01L23/5383 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/18 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19105 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10674 ,  H05K2203/1469 ,  H01L2224/82 ,  H01L2924/00

Abstract: A semiconductor device includes a wafer having a frontside and a backside. The wafer is formed from at least one integrated circuit chip having an electrical connection frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. A passive component including at least one conductive plate and a dielectric plate is positioned adjacent the integrated circuit chip. An encapsulation block embeds the integrated circuit chip and the passive component, the block having a frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. An electrical connection is made between the electrical connection frontside and the passive component. That electrical connection includes connection lines placed on the wafer frontside and wafer backside. The electrical connection further includes at least one via passing through the encapsulation block.

Abstract translation: 半导体器件包括具有前侧和后侧的晶片。 晶片由至少一个集成电路芯片形成，该集成电路芯片具有与晶片前侧共面的电连接，以及与晶片背面共面的背面。 包括至少一个导电板和电介质板的无源部件位于集成电路芯片附近。 封装块嵌入集成电路芯片和无源部件，该块具有与晶片前侧共面的前侧和与晶片背面共面的背面。 在电连接前端和被动部件之间进行电连接。 该电连接包括放置在晶片正面和晶片背面上的连接线。 电连接还包括至少一个通过封装块的通孔。

公开(公告)号：US20130248887A1

公开(公告)日：2013-09-26

申请号：US13845445

申请日：2013-03-18

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS ,  STMICROELECTRONICS PTE LTD

Inventor： Romain Coffy ,  Eric Saugier ,  Hk Looi ,  Norbert Chevrier

IPC: H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/0203 ,  G01S7/481 ,  G01S17/026 ,  H01L25/167 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H03K17/941 ,  H03K2017/9455 ,  H03K2217/94026 ,  H03K2217/94112 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.

Abstract translation: 光学电子封装包括固定到晶片的透射芯片和接收芯片。 透明封装结构由形成在发射机芯片和接收芯片的至少一部分上的透明板和透明封装块形成，透明封装块嵌入发射器芯片。 不透明的封装块在透明板上延伸并且包括露出透明板的前部区域的开口。 前部区域位于发射芯片的光发射机之上，相对于接收芯片的光学传感器横向偏移。