公开(公告)号：US20200098670A1

公开(公告)日：2020-03-26

申请号：US16696698

申请日：2019-11-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Concetto PRIVITERA ,  Maurizio Maria FERRARA ,  Fabio Vito COPPONE

IPC: H01L23/495 ,  H01L23/34 ,  H01L23/00

Abstract: Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heatsink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heatsink element. The heatsink element is formed by a heatsink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heatsink die towards the body and rest on the body.

公开(公告)号：US20160225699A1

公开(公告)日：2016-08-04

申请号：US14961586

申请日：2015-12-07

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Concetto PRIVITERA ,  Maurizio Maria FERRARA ,  Fabio Vito COPPONE

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/34

CPC classification number: H01L23/49503 ,  H01L23/34 ,  H01L23/49524 ,  H01L24/83 ,  H01L2924/173

Abstract: Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heat-sink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heat-sink element. The heat-sink element is formed by a heat-sink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heat-sink die towards the body and rest on the body.

Abstract translation: 具有导电材料的框架的封装半导体器件; 半导体材料体，通过第一粘合剂层固定到框架; 散热元件，通过第二粘合剂层固定到主体; 以及围绕身体并且至少部分地包括框架和散热元件的包装物质。 散热元件由面向并与该器件的主面共面的散热片和间隔结构形成，该间隔结构包括从散热片的周边向本体突出的一对基座 并休息在身上。