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公开(公告)号：US20190229147A1
公开(公告)日：2019-07-25
申请号：US16251595
申请日：2019-01-18
Applicant: STMicroelectronics (Crolles 2) SAS
Inventor： Yannick SANCHEZ , Emilie DELOFFRE
IPC: H01L27/146
Abstract: An image sensor manufacturing method includes forming a cavity in a first plate and mounting an active layer including both image sensing components and logic components to the first plate. The active layer is pressed against the first plate in a manner such that the image sensing components in the active layer are located on walls of the cavity and the logic components in the active layer are located outside of the cavity.
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