公开(公告)号：US20240186679A1

公开(公告)日：2024-06-06

申请号：US18526427

申请日：2023-12-01

Applicant: STMicroelectronics International N.V.

Inventor： Romain COFFY ,  Laurent SCHWARTZ ,  Ludovic FOURNEAUD

IPC: H01Q1/22 ,  H01L21/56 ,  H01L23/31 ,  H05K1/02

CPC classification number: H01Q1/2283 ,  H01L21/56 ,  H01L23/3121 ,  H05K1/0237 ,  H01L24/16 ,  H05K2201/10098

Abstract: A waveguide has a first input/output for receiving/outputting a radio frequency (RF) wave and guiding the RF wave between the first input/output and a second input/output. An electronic integrated circuit chip is electrically connected at a front face to a metal level of a carrier substrate which includes a patch antenna. An electrically insulating embedding material surrounds the electronic chip and is disposed between the patch antenna and the first input/output of the waveguide which is at least in contact with the embedding material. The electronic chip cooperates electrically with the patch antenna so as to cause the patch antenna to transmit the RF wave to the first input/output through the embedding material. The electronic chip also processes an electrical signal from the patch antenna in response to the patch antenna receiving the radio frequency wave output by the first input/output via the embedding material.