公开(公告)号：US20030001279A1

公开(公告)日：2003-01-02

申请号：US10184027

申请日：2002-06-27

Applicant: STMicroelectronics S.A.

Inventor： Daniel Gloria ,  Andre Perrotin

IPC: H01L023/48

CPC classification number: H01L23/66 ,  H01L23/5283 ,  H01L2223/6622 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A multilayer semiconductor device includes at least one structure for transmitting electrical signals, and in particular, microwave signals. The device includes at least one electrically conductive enclosure that includes a bottom plate and a top plate in two different layers. Lateral walls connect the bottom and top plates. Electrically conductive connecting strips extend into the enclosure and are in an intermediate layer, and are electrically insulated from the enclosure. The enclosure has at least one passage through which extends electrical connections of the connecting strips, which are also electrically insulated from the enclosure.

Abstract translation: 多层半导体器件包括用于传输电信号，特别是微波信号的至少一种结构。 该装置包括至少一个导电外壳，其包括底板和两个不同层中的顶板。 侧壁连接底板和顶板。 导电连接条延伸到外壳中并处于中间层，并与外壳电绝缘。 外壳具有至少一个通道，通过该通道延伸连接条的电连接，其也与外壳电绝缘。