公开(公告)号：US20040256686A1

公开(公告)日：2004-12-23

申请号：US10821263

申请日：2004-04-08

Applicant: STMicroelectronics S.r.l.

Inventor： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC: H01L029/82 ,  H01L021/30

CPC classification number: H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

Abstract: A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

Abstract translation: 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一层半导体材料的第一半导体晶片和布置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。