公开(公告)号：US12230511B2

公开(公告)日：2025-02-18

申请号：US17398710

申请日：2021-08-10

Applicant: STMicroelectronics S.r.l.

Inventor： Fulvio Vittorio Fontana ,  Marco Rovitto

IPC: H01L21/48 ,  H01L21/67 ,  H01L23/495

Abstract: At least one semiconductor chip or die is held within at a chip retaining formation provided in a chip holding device. The chip holding device is then positioned with the at least one semiconductor chip or die arranged facing a chip attachment location in a chip mounting substrate. This positioning produces a cavity between the at least one semiconductor chip or die arranged at the chip retaining formation and the chip attachment location in the chip mounting substrate. A chip attachment material is dispensed into the cavity. Once cured, the chip attachment material attaches the at least one semiconductor chip or die onto the substrate at the chip attachment location in the chip mounting substrate.