公开(公告)号：US20230042407A1

公开(公告)日：2023-02-09

申请号：US17878676

申请日：2022-08-01

Applicant: STMicroelectronics S.r.l.

Inventor： Paolo CASATI ,  Federico FREGO

IPC: H01L21/48 ,  H01L23/495

Abstract: Semiconductor devices are arranged in a chain extending in a longitudinal direction have mutually facing end sides transverse the longitudinal direction and are coupled via tie bars located at the mutually facing end sides. The tie bars are provided with anchoring tips penetrating into an insulating package at mutually facing end sides of the devices. The tie bars can be deformed to extract the anchoring tips from the insulating package at the mutually facing end sides of the devices. Individual singulated devices are thus produced in response to the anchoring tips being extracted from the mutually facing end sides of the devices.