公开(公告)号：US20230042407A1

公开(公告)日：2023-02-09

申请号：US17878676

申请日：2022-08-01

Applicant: STMicroelectronics S.r.l.

Inventor： Paolo CASATI ,  Federico FREGO

IPC: H01L21/48 ,  H01L23/495

Abstract: Semiconductor devices are arranged in a chain extending in a longitudinal direction have mutually facing end sides transverse the longitudinal direction and are coupled via tie bars located at the mutually facing end sides. The tie bars are provided with anchoring tips penetrating into an insulating package at mutually facing end sides of the devices. The tie bars can be deformed to extract the anchoring tips from the insulating package at the mutually facing end sides of the devices. Individual singulated devices are thus produced in response to the anchoring tips being extracted from the mutually facing end sides of the devices.

公开(公告)号：US20190181076A1

公开(公告)日：2019-06-13

申请号：US16213540

申请日：2018-12-07

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Dario VITELLO ,  Fabio MARCHISI ,  Alberto ARRIGONI ,  Federico FREGO ,  Federico Giovanni ZIGLIOLI ,  Paolo CREMA

IPC: H01L23/495 ,  H01L21/48 ,  B26F1/38 ,  B23C3/13 ,  C23F1/02

Abstract: A method of producing leadframes for semiconductor devices comprises: providing a plurality of electrically-conductive plates, forming in the electrically conductive plates homologous passageway patterns according to a desired semiconductor device leadframe pattern, joining together the plurality of plates with the homologous passageway patterns formed therein mutually in register by producing a multilayered leadframe exhibiting the desired leadframe pattern and a thickness which is the sum of the thicknesses of the plates in the plurality of electrically-conductive plates.