公开(公告)号：US20030002195A1

公开(公告)日：2003-01-02

申请号：US10161054

申请日：2002-05-30

Applicant: STMicroelectronics S.r.l

Inventor： Simone Sassolini ,  Benedetto Vigna

IPC: G11B021/02 ,  G11B005/00

CPC classification number: G11B5/6005 ,  G11B5/5552 ,  G11B5/5582

Abstract: In an actuator device for hard disks a suspension element carries a slider that is subject to undesired vibrations which give rise to rotations of the slider with respect to a nominal position. An electrostatically controlled position-control structure is arranged between the suspension and the slider and is controlled in an active way so as to generate torsions of the platform that counter the undesired rotations. The position-control structure comprises a platform of conductive material and control electrodes arranged underneath the platform. The platform is connected to a load-bearing structure by spring elements that enable movements of roll and pitch. Four control electrodes are arranged according to the quadrants of a square and can be selectively biased for generating electrical forces acting on the platform.

Abstract translation: 在用于硬盘的致动器装置中，悬挂元件承载滑动器，该滑块受到引起滑块相对于标称位置的旋转的不期望的振动。 静电控制的位置控制结构布置在悬架和滑块之间，并且以主动的方式被控制，以便产生平衡物的扭转以抵抗不需要的旋转。 位置控制结构包括布置在平台下方的导电材料和控制电极的平台。 平台通过弹簧元件连接到承载结构，使弹簧能够运动和俯仰。 根据正方形的象限布置四个控制电极，并且可以选择性地偏置以产生作用在平台上的电力。

公开(公告)号：US20040256686A1

公开(公告)日：2004-12-23

申请号：US10821263

申请日：2004-04-08

Applicant: STMicroelectronics S.r.l.

Inventor： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC: H01L029/82 ,  H01L021/30

CPC classification number: H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

Abstract: A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

Abstract translation: 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一层半导体材料的第一半导体晶片和布置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。

公开(公告)号：US20030077881A1

公开(公告)日：2003-04-24

申请号：US10214998

申请日：2002-08-08

Applicant: STMicroelectronics S.r.l.

Inventor： Ilaria Gelmi ,  Simone Sassolini ,  Stefano Pozzi ,  Massimo Garavaglia

IPC: H01L021/301

CPC classification number: B81C1/0088

Abstract: A method for manipulating MEMS devices integrated on a semiconductor wafer and intended to be diced one from the other includes bonding of the semiconductor wafer including the MEMS devices on a support with interposition of a bonding sheet. The method may also include completely cutting or dicing of the semiconductor wafer into a plurality of independent MEMS devices, and processing the MEMS devices diced and bonded on the support in a treatment environment for semiconductor wafers. A support for manipulating MEMS devices is also included.

Abstract translation: 用于操作集成在半导体晶片上并且要彼此切割的MEMS器件的方法包括将包括MEMS器件的半导体晶片粘合在支撑体上并插入粘结片。 该方法还可以包括将半导体晶片完全切割或切割成多个独立的MEMS器件，以及在半导体晶片的处理环境中处理在支撑体上切割和结合的MEMS器件。 还包括用于操纵MEMS器件的支持。