公开(公告)号：US20220158683A1

公开(公告)日：2022-05-19

申请号：US16951726

申请日：2020-11-18

Applicant: STMicroelectronics SA

Inventor： Jocelyn Roux

IPC: H04B1/40 ,  H03F3/19

Abstract: The invention relates to a radio frequency assembly comprising a radio frequency circuit comprising at least one group of N≥2 amplifiers (A1, A2) disposed in series on a substrate (1), said assembly comprising a package (2) wherein the substrate (1) is disposed, each amplifier comprising a local grounding point (b1, b2, b3) and a local feed point (a1, a2, a3), said common grounding points being connected to a common ground (GND) outside the package (2), said common feed points being connected to a common power supply (VDD) outside the package, said assembly comprising at least N−1 parallel LC circuits disposed between the common power supply (VDD) and the local feed point (a2, a3) of an amplifier (A2) so as to attenuate the current loops between two amplifiers in series.

公开(公告)号：US11677431B2

公开(公告)日：2023-06-13

申请号：US16951726

申请日：2020-11-18

Applicant: STMicroelectronics SA

Inventor： Jocelyn Roux

IPC: H03F3/19 ,  H04B1/40

CPC classification number: H04B1/40 ,  H03F3/19 ,  H03F2200/451

Abstract: The invention relates to a radio frequency assembly comprising a radio frequency circuit comprising at least one group of N≥2 amplifiers (A1, A2) disposed in series on a substrate (1), said assembly comprising a package (2) wherein the substrate (1) is disposed, each amplifier comprising a local grounding point (b1, b2, b3) and a local feed point (a1, a2, a3), said common grounding points being connected to a common ground (GND) outside the package (2), said common feed points being connected to a common power supply (VDD) outside the package, said assembly comprising at least N−1 parallel LC circuits disposed between the common power supply (VDD) and the local feed point (a2, a3) of an amplifier (A2) so as to attenuate the current loops between two amplifiers in series.