Abstract:
A three-dimensional integrated structure may include two assembled integrated circuits respectively including two metallic lines, and at least two cavities passing through one of the integrated circuits and opening onto two locations respectively in electrical contact with the two metallic lines. The cavities may be sized to place a measuring apparatus at the bottom of the cavities, and in electrical contact with the two locations.
Abstract:
A mechanical structure comprising a stack including an active substrate and at least one actuator designed to generate vibrations at the active substrate, the stack comprises an elementary structure for amplifying the vibrations: positioned between the actuator and the active substrate, the structure designed to transmit and amplify the vibrations; and comprising at least one trench, located between the actuator and the active substrate. A method for manufacturing the structure comprising the use of a temporary substrate is provided.
Abstract:
A vibrating device comprises: a first support configured to be deformed having a surface defined in a plane in directions X and Y; at least one actuator configured to generate plate modes propagated in the first support; the first support comprising: at least one defect with respect to the propagation of the plate modes; the defect being of geometrical nature or corresponding to a structural heterogeneity; comprising: a second support; at least one embedded mechanical reflector secured to the first support and in contact with the first support, configured to immobilize the first support in at least one direction Z at right angles to the directions X and Y, the mechanical reflector being secured to the second support and; the embedded mechanical reflector being configured to isolate a so-called active zone belonging to the surface defined in a plane in directions X and Y in which the plate modes are propagated, the active zone excluding the defect; the actuator being situated in the active region.