公开(公告)号：US20230029946A1

公开(公告)日：2023-02-02

申请号：US17871452

申请日：2022-07-22

Applicant: STMicroelectronics SA ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Victor FIORESE ,  Jean-Francois CAILLET ,  Frederic GIANESELLO ,  Fanny LAPORTE

IPC: H01L23/055 ,  H01L23/498 ,  H01L23/66 ,  H01L21/52

Abstract: The present description concerns an electromagnetic wave transmit/receive device comprising a multilayer organic substrate, an integrated circuit chip, flip-chip assembled on the multilayer organic substrate, a package comprising a first cavity, containing the multilayer organic substrate and the integrated circuit chip, and communicating over a channel with a second cavity forming a waveguide for electromagnetic waves.