公开(公告)号：US09033470B2

公开(公告)日：2015-05-19

申请号：US13978768

申请日：2011-01-31

申请人： Sadiq Bengali ,  Galen P Cook ,  Michael W Cumbie ,  Robert K Messenger

发明人： Sadiq Bengali ,  Galen P Cook ,  Michael W Cumbie ,  Robert K Messenger

IPC分类号： B41J2/05 ,  B41J2/14 ,  B41J2/16

CPC分类号： B41J2/05 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1645 ,  B41J2002/14467

摘要： In one embodiment, a fluid ejection device includes a substrate with a fluid slot and a membrane adhered to the substrate that spans the fluid slot. A resistor is disposed on top of the membrane over the fluid slot, and a fluid feed hole next to the resistor extends through the membrane to the slot. A shelf extends from the edge of the resistor to the edge of the feed hole, and a passivation layer covers the resistor and part the shelf. An etch-resistant layer is formed partly on the shelf and in between the fluid feed hole and the resistor.

摘要翻译： 在一个实施例中，流体喷射装置包括具有流体狭槽的基底和附着到跨越流体狭槽的基底的膜。 电阻器设置在流体槽上的膜的顶部上，并且电阻旁边的流体供给孔延伸穿过膜到槽。 一个搁板从电阻器的边缘延伸到馈电孔的边缘，钝化层覆盖电阻器和部件。 防腐蚀层部分地形成在搁板上并且在流体供给孔和电阻器之间。