MASK ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20220195578A1

    公开(公告)日:2022-06-23

    申请号:US17516030

    申请日:2021-11-01

    Abstract: A manufacturing method of a mask assembly includes forming a cell mask including masking patterns and a mesh frame including conductive patterns disposed to correspond to the masking patters and disposing the cell mask and the mesh frame on a mask frame. The forming the cell mask and the mesh frame includes forming a polymer layer, a conductive layer, and a hard masking layer, forming a mask pattern layer including etch patterns, and forming the cell mask and the mesh frame using the mask pattern layer.

    MASK ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20240384392A1

    公开(公告)日:2024-11-21

    申请号:US18788939

    申请日:2024-07-30

    Abstract: A manufacturing method of a mask assembly includes forming a cell mask including masking patterns and a mesh frame including conductive patterns disposed to correspond to the masking patters and disposing the cell mask and the mesh frame on a mask frame. The forming the cell mask and the mesh frame includes forming a polymer layer, a conductive layer, and a hard masking layer, forming a mask pattern layer including etch patterns, and forming the cell mask and the mesh frame using the mask pattern layer.

    DISPLAY DEVICE
    3.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20230180524A1

    公开(公告)日:2023-06-08

    申请号:US17820090

    申请日:2022-08-16

    Abstract: A display device includes a substrate including first, second, and third light emitting areas and a light blocking area surrounding the first, second, and third light emitting areas, a driving element on the substrate, a light emitting element respectively in each of the first, second, and third light emitting areas on the driving element and electrically connected to the driving element, a color conversion layer including a first color conversion pattern, a second color conversion pattern, and a transmission pattern in the first, second, and third light emitting areas on the light emitting element, respectively, and a capping layer on the color conversion layer and including a silicon compound. A ratio of a hydrogen content of an N—H bond to a hydrogen content of a Si—H bond of the capping layer is about 16 or more.

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