公开(公告)号：US20210003876A1

公开(公告)日：2021-01-07

申请号：US17025857

申请日：2020-09-18

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han Ho PARK ,  Dae Geun LEE ,  Su Jeong KIM ,  Sang Won YEO ,  Kyung Mok LEE ,  Wu Hyen JUNG

IPC: G02F1/1345 ,  G09F9/35 ,  H01L23/00 ,  H05K1/11 ,  H05K3/32

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

公开(公告)号：US20180149901A1

公开(公告)日：2018-05-31

申请号：US15807455

申请日：2017-11-08

Applicant: Samsung Display Co., Ltd.

Inventor： Han Ho PARK ,  Dae Geun LEE ,  Su Jeong KIM ,  Sang Won YEO ,  Kyung Mok LEE ,  Wu Hyen JUNG

IPC: G02F1/1345 ,  G09F9/35 ,  H05K1/11 ,  H01L23/00 ,  H05K3/32

CPC classification number: G02F1/13452 ,  G02F1/133305 ,  G02F1/13454 ,  G02F1/13458 ,  G09F9/35 ,  H01L24/06 ,  H01L2224/50 ,  H01L2224/79 ,  H01L2224/86 ,  H01L2225/06579 ,  H05K1/117 ,  H05K1/118 ,  H05K3/321 ,  H05K2201/09427 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

公开(公告)号：US20190278125A1

公开(公告)日：2019-09-12

申请号：US16422708

申请日：2019-05-24

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han Ho PARK ,  Dae Geun LEE ,  Su Jeong KIM ,  Sang Won YEO ,  Kyung Mok LEE ,  Wu Hyen JUNG

IPC: G02F1/1345 ,  H01L23/00 ,  H05K1/11 ,  H05K3/32 ,  G09F9/35

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

公开(公告)号：US20240111194A1

公开(公告)日：2024-04-04

申请号：US18537672

申请日：2023-12-12

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han Ho PARK ,  Dae Geun LEE ,  Su Jeong KIM ,  Sang Won YEO ,  Kyung Mok LEE ,  Wu Hyen JUNG

IPC: G02F1/1345 ,  G09F9/35 ,  H01L23/00 ,  H05K1/11 ,  H05K3/32

CPC classification number: G02F1/13452 ,  G02F1/13458 ,  G09F9/35 ,  H01L24/06 ,  H05K1/117 ,  H05K1/118 ,  H05K3/321 ,  G02F1/133305

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

公开(公告)号：US20210125954A1

公开(公告)日：2021-04-29

申请号：US16897380

申请日：2020-06-10

Applicant: Samsung Display Co., LTD.

Inventor： Jin Sic MIN ,  Min Jung NA ,  Sang Won YEO ,  Jong In LEE ,  Chang Sub JUNG

IPC: H01L23/00 ,  B32B7/12 ,  B32B37/12

Abstract: A method of manufacturing a display device, includes: providing an adhesive tape including: an adhesive conductive layer on a base film, a cutting width corresponding to a width of an adhesive tape attaching area of a substrate and provided in plurality including cutting widths adjacent to each other along the base film, and an interval between the cutting widths adjacent to each other; within the interval, providing a plurality of half-cuts in the adhesive tape, to provide a multi-cut adhesive tape; and pressing the multi-cut adhesive tape to the substrate, at a first portion of the multi-cut adhesive tape which corresponds to the cutting width, to separate the first portion of the multi-cut adhesive tape from the base film and attach the first portion of the multi-cut adhesive tape to the substrate at the adhesive tape attaching area thereof.

公开(公告)号：US20220276523A1

公开(公告)日：2022-09-01

申请号：US17743101

申请日：2022-05-12

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han Ho PARK ,  Dae Geun LEE ,  Su Jeong KIM ,  Sang Won YEO ,  Kyung Mok LEE ,  Wu Hyen JUNG

IPC: G02F1/1345 ,  G09F9/35 ,  H01L23/00 ,  H05K1/11 ,  H05K3/32

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.