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公开(公告)号:US20240111194A1
公开(公告)日:2024-04-04
申请号:US18537672
申请日:2023-12-12
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Han Ho PARK , Dae Geun LEE , Su Jeong KIM , Sang Won YEO , Kyung Mok LEE , Wu Hyen JUNG
IPC: G02F1/1345 , G09F9/35 , H01L23/00 , H05K1/11 , H05K3/32
CPC classification number: G02F1/13452 , G02F1/13458 , G09F9/35 , H01L24/06 , H05K1/117 , H05K1/118 , H05K3/321 , G02F1/133305
Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.
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公开(公告)号:US20210003876A1
公开(公告)日:2021-01-07
申请号:US17025857
申请日:2020-09-18
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Han Ho PARK , Dae Geun LEE , Su Jeong KIM , Sang Won YEO , Kyung Mok LEE , Wu Hyen JUNG
IPC: G02F1/1345 , G09F9/35 , H01L23/00 , H05K1/11 , H05K3/32
Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.
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公开(公告)号:US20220276523A1
公开(公告)日:2022-09-01
申请号:US17743101
申请日:2022-05-12
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Han Ho PARK , Dae Geun LEE , Su Jeong KIM , Sang Won YEO , Kyung Mok LEE , Wu Hyen JUNG
IPC: G02F1/1345 , G09F9/35 , H01L23/00 , H05K1/11 , H05K3/32
Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.
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公开(公告)号:US20210364416A1
公开(公告)日:2021-11-25
申请号:US17182707
申请日:2021-02-23
Applicant: Samsung Display Co., Ltd.
Inventor: Han Ho PARK , Hyung-Don NA , Kyung Jun PARK , Eun Ji PARK , Chang Seob JUNG , Hyeon Deuk HWANG
IPC: G01N19/04
Abstract: A method of measuring adhesive strength includes setting an evaluation time (te), fixing a substrate and an adhesive member to a measurement device, pulling the adhesive member fixed to the measurement device with a first measurement force (Fe1) for the evaluation time (te), pulling the adhesive member fixed to the measurement device is pulled with a second measurement force (Fe2), which is obtained by increasing the first measurement force (Fe1) by a preset amount, for the evaluation time (te), and determining a reference measurement force (Fes) which is a static force applied to the adhesive member when a distance by which a first portion of the adhesive member is detached from the substrate is equal to a preset distance (dt) is determined.
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公开(公告)号:US20180149901A1
公开(公告)日:2018-05-31
申请号:US15807455
申请日:2017-11-08
Applicant: Samsung Display Co., Ltd.
Inventor: Han Ho PARK , Dae Geun LEE , Su Jeong KIM , Sang Won YEO , Kyung Mok LEE , Wu Hyen JUNG
IPC: G02F1/1345 , G09F9/35 , H05K1/11 , H01L23/00 , H05K3/32
CPC classification number: G02F1/13452 , G02F1/133305 , G02F1/13454 , G02F1/13458 , G09F9/35 , H01L24/06 , H01L2224/50 , H01L2224/79 , H01L2224/86 , H01L2225/06579 , H05K1/117 , H05K1/118 , H05K3/321 , H05K2201/09427 , H05K2201/10128 , H05K2201/10681
Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.
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公开(公告)号:US20230301148A1
公开(公告)日:2023-09-21
申请号:US18177928
申请日:2023-03-03
Applicant: Samsung Display Co., LTD.
Inventor: Han Ho PARK , Eui Jeong KANG , Min Hee PARK , Jeong Eun PARK , Joong Mok LEE , Chung Seok LEE , Suk Ho CHOI
IPC: H10K59/131 , H10K59/80 , H10K77/10 , H10K59/12
CPC classification number: H10K59/131 , H10K59/80 , H10K77/111 , H10K59/1201 , H10K2102/311
Abstract: A display device includes a substrate including a bending area, a flat area adjacent to the bending area, and first and second surfaces opposite to each other, a display unit corresponding to the flat area and on the first surface, a support layer which is on the second surface of the substrate, corresponds to the flat area, and is disconnected at the bending area to define an end portion closest to the bending area, and the substrate defining a groove in the bending area. The end portion of the support layer is bendable together with the substrate and includes a flat portion corresponding to the flat area of the substrate, and a bending portion corresponding to the bending area of the substrate. The substrate which is unbent disposes the bending portion having an acute angle of inclination with respect to the second surface of the substrate.
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公开(公告)号:US20190278125A1
公开(公告)日:2019-09-12
申请号:US16422708
申请日:2019-05-24
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Han Ho PARK , Dae Geun LEE , Su Jeong KIM , Sang Won YEO , Kyung Mok LEE , Wu Hyen JUNG
IPC: G02F1/1345 , H01L23/00 , H05K1/11 , H05K3/32 , G09F9/35
Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.
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