公开(公告)号：US20210114163A1

公开(公告)日：2021-04-22

申请号：US17036062

申请日：2020-09-29

Applicant: Samsung Display Co., LTD. ,  KCTECH CO.,LTD.

Inventor： Seung Bae KANG ,  Sung Hyeon PARK ,  Jung Gun NAM ,  Joon-Hwa BAE ,  Kyung Bo LEE ,  Keun Woo LEE ,  Woo Jin CHO ,  Byoung Kwon CHOO

IPC: B24B37/015 ,  B24B37/04 ,  H01L27/32 ,  H01L51/00 ,  H01L51/56 ,  C03C19/00

Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.