公开(公告)号：US11597052B2

公开(公告)日：2023-03-07

申请号：US16448980

申请日：2019-06-21

申请人： Applied Materials, Inc.

发明人： Hari Soundararajan ,  Shou-Sung Chang ,  Haosheng Wu ,  Jianshe Tang ,  Jeonghoon Oh ,  Rajeev Bajaj ,  Andrew Siordia

IPC分类号： B24B49/00 ,  B24B37/015 ,  B24B37/20 ,  B24B57/02 ,  B24B37/27 ,  G05D23/24

摘要： A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.

公开(公告)号：US11577357B2

公开(公告)日：2023-02-14

申请号：US16692710

申请日：2019-11-22

申请人： EBARA CORPORATION

发明人： Yasuyuki Motoshima

IPC分类号： B24B49/00 ,  B24B37/015 ,  H01L21/304

摘要： An object of the present invention is to improve in-plane uniformity in polishing in a polishing device.
A temperature adjusting device for adjusting temperature of a rotating polishing pad comprises: a heat conductor that can contact with a top face of the polishing pad; an arm for holding the heat conductor above the polishing pad; column members formed to stand on a top face of the heat conductor, comprising an upstream-side column member and a downstream-side column member arranged at a position at an upstream/downstream side of rotation of the polishing pad; and overhung members extending, from the upstream-side column member and the downstream-side column member, in directions that are parallel to the top face of the heat conductor; wherein the overhung members can contact with a top face of the arm.

公开(公告)号：US20220290009A1

公开(公告)日：2022-09-15

申请号：US17447343

申请日：2021-09-10

申请人： Kioxia Corporation

发明人： Mikiya SAKASHITA ,  Yukiteru MATSUI

IPC分类号： C09G1/18 ,  B24B37/10 ,  B24B41/06 ,  B24B37/015

摘要： A polishing solution according to an embodiment includes an exothermic agent that generates heat through application of an alternating magnetic field thereto, and a viscosity modifier that undergoes a reversible phase transition between a gel state and a sol state depending on temperature.

公开(公告)号：US20220281061A1

公开(公告)日：2022-09-08

申请号：US17677891

申请日：2022-02-22

申请人： Applied Materials, Inc.

发明人： Ekaterina A. Mikhaylichenko ,  Christopher Heung-Gyun Lee ,  Anand N. Iyer ,  Huyen Tran ,  Patrick A. Higashi

IPC分类号： B24B37/015

摘要： A method for removing material from a substrate includes dispensing an abrasive slurry on a polishing pad, storing an indication of a relative charge on the abrasive agent, contacting a surface of a substrate to the polishing pad in the presence of the slurry, generating relative motion between the substrate and the polishing pad, measuring a removal rate for the substrate, comparing a the measured removal rate to a target removal rate and determining whether to increase or decrease the removal rate based on the comparison, determining whether to increase or decrease a temperature of an interface between the polishing pad and the substrate based on the indication of the relative charge of the abrasive agent and on whether to increase or decrease the removal rate, and controlling a temperature of the interface as determined to modify the removal rate.

公开(公告)号：US20220184773A1

公开(公告)日：2022-06-16

申请号：US17685760

申请日：2022-03-03

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Cheng-Ping Chen ,  Ren-Dou Lee ,  Sheng-Tai Peng ,  Tsung-Lung Lai ,  Tzi-Yi Shieh ,  Chien-Wei Chang

IPC分类号： B24B37/32 ,  H01L21/321 ,  B24B37/20 ,  B24B37/015

摘要： In some embodiments, the present disclosure relates to a chemical mechanical planarization (CMP) tool. The CMP tool includes a carrier and a malleable membrane coupled to the carrier and having a lower surface facing away from the carrier. The lower surface of the malleable membrane includes a first malleable material within a central region of the lower surface and a second malleable material within a peripheral region of the lower surface, which surrounds the central region. The first malleable material provides the central region of the lower surface with a first stiffness and the second malleable material provides the peripheral region of the lower surface with a second stiffness that is different than the first stiffness.

公开(公告)号：US20220072679A1

公开(公告)日：2022-03-10

申请号：US17417294

申请日：2019-12-19

申请人： EBARA CORPORATION

发明人： Toru MARUYAMA

IPC分类号： B24B37/015 ,  B24B37/20 ,  B24B49/14

摘要： The present application relates to a pad-temperature regulating apparatus for regulating a temperature of a surface of a polishing pad. The pad-temperature regulating apparatus includes a pad-contact member, a supply system for supplying a heating liquid and a cooling liquid into the pad contact member, a pad-temperature measuring device for measuring the temperature of the surface of the polishing pad, and a controller for performing a PID control of manipulated variables of a first flow control valve and a second flow control valve. The controller includes a memory in which a learned model constructed to maintain a temperature behavior curve, created based on measured values of the pad-temperature measuring device, within a predetermined allowable range, is stored; and a processing device which inputs at least one temperature behavior parameter to the learned model, and performs a calculation to output a change value of PID parameter for the PID control.

公开(公告)号：US20220055178A1

公开(公告)日：2022-02-24

申请号：US17274480

申请日：2018-10-05

申请人： CVE TECHNOLOGY GROUP, INC.

发明人： Myung Ki KIM

IPC分类号： B24B37/015 ,  B24B57/02 ,  B24B37/10 ,  B24B41/02

摘要： Polishing systems and methods are described. An exemplar polishing system includes: (i) a jig designed to secure mobile device; (ii) a polishing head designed to contact and polish a mobile device surface; (iii) a spindle disposed above the jig and fitted with the polishing head; (iv) a slurry dispenser arranged adjacent to the spindle and designed to store and dispense polishing slurry on the mobile device surface; and (v) a central controller programmed to control operation of the jig, the spindle, and the slurry dispenser such that during an operative state of the jig and the spindle, and under control of the central controller, the slurry dispenser dispenses polishing slurry to facilitate polishing of the mobile device surface.

公开(公告)号：US20210402555A1

公开(公告)日：2021-12-30

申请号：US17362802

申请日：2021-06-29

申请人： Applied Materials, Inc.

发明人： Surajit Kumar ,  Hari Soundararajan ,  Hui Chen ,  Shou-Sung Chang

IPC分类号： B24B37/015 ,  B24B37/10 ,  B24B37/26

摘要： A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.

公开(公告)号：US20210402552A1

公开(公告)日：2021-12-30

申请号：US16932615

申请日：2020-07-17

申请人： Applied Materials, Inc.

发明人： Surajit Kumar ,  Hui Chen ,  Chih Chung Chou ,  Shou-Sung Chang

IPC分类号： B24B37/015 ,  B24B37/34

摘要： A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.

公开(公告)号：US20210229240A1

公开(公告)日：2021-07-29

申请号：US17233115

申请日：2021-04-16

申请人： EBARA CORPORATION

发明人： Hiroshi Sotozaki ,  Tadakazu Sone

IPC分类号： B24B57/02 ,  B24B37/04 ,  B24B37/015 ,  B24B49/14 ,  B24B55/06 ,  B24B37/10 ,  B24B55/12 ,  B24B55/02

摘要： Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.