公开(公告)号：US20210223818A1

公开(公告)日：2021-07-22

申请号：US17019830

申请日：2020-09-14

Applicant: Samsung Display Co., Ltd.

Inventor： Daehwan JANG ,  Hyun a LEE ,  Chan-Jae PARK ,  SUNOK OH ,  Kikyung YOUK ,  Sangduk LEE

IPC: G06F1/16 ,  G02B1/14 ,  B32B3/06

Abstract: An adhesive member is between an electronic component and an electronic panel that are connected to each other through the adhesive member. The adhesive member has a second surface and a first surface. The adhesive member includes a first recess pattern recessed from the first surface and a second recess pattern recessed from the first surface. The second recess pattern is spaced apart in a first direction from the first recess pattern. A sum of a planar area of the first recess pattern and a planar area of the second recess pattern ranges from about 20 percent (%) to about 70% of a planar area of the first surface.

公开(公告)号：US20210151543A1

公开(公告)日：2021-05-20

申请号：US16944707

申请日：2020-07-31

Applicant: Samsung Display Co., Ltd.

Inventor： Chan-Jae PARK ,  Sangduk LEE ,  Heeju WOO ,  Kikyung YOUK ,  Hyun a LEE ,  Daehwan JANG

IPC: H01L27/32 ,  H01L23/00

Abstract: A method for manufacturing a display device includes providing an electronic component between a plurality of bumps, providing a display panel, aligning the electronic component and the display panel, and applying ultrasonic waves to bond the plurality of bumps to signal pads. In providing first adhesive members, at least a portion of a top surface of each of the plurality of bumps is exposed between the first adhesive members.

公开(公告)号：US20220328451A1

公开(公告)日：2022-10-13

申请号：US17851358

申请日：2022-06-28

Applicant: Samsung Display Co., Ltd.

Inventor： Chan-Jae PARK ,  Kikyung YOUK ,  Sangduk LEE ,  Hyun a LEE ,  Daehwan JANG

IPC: H01L23/00 ,  H01L25/18 ,  H01L25/00 ,  H01L27/32

Abstract: A display device includes a display panel including a display area and a non-display area defined therein and including a plurality of signal pads overlapping the non-display area, an electronic component including a base layer with an upper surface and a lower surface, a plurality of driving pads disposed on the lower surface of the base layer, and a plurality of driving bumps respectively disposed on the plurality of driving pads, the plurality of driving bumps being respectively connected to the signal pads, and a filler disposed between the display panel and the electronic component. A first hole is defined in the upper surface of the base layer, and the first hole does not overlap the plurality of driving bumps in a plan view.

公开(公告)号：US20210094238A1

公开(公告)日：2021-04-01

申请号：US16886993

申请日：2020-05-29

Applicant: Samsung Display Co., Ltd.

Inventor： Hyun a LEE ,  Chan-Jae PARK ,  Heeju WOO ,  Kikyung YOUK ,  Sangduk LEE ,  Daehwan JANG

IPC: B29C65/08 ,  H05K3/30

Abstract: An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.