公开(公告)号：US20210151543A1

公开(公告)日：2021-05-20

申请号：US16944707

申请日：2020-07-31

Applicant: Samsung Display Co., Ltd.

Inventor： Chan-Jae PARK ,  Sangduk LEE ,  Heeju WOO ,  Kikyung YOUK ,  Hyun a LEE ,  Daehwan JANG

IPC: H01L27/32 ,  H01L23/00

Abstract: A method for manufacturing a display device includes providing an electronic component between a plurality of bumps, providing a display panel, aligning the electronic component and the display panel, and applying ultrasonic waves to bond the plurality of bumps to signal pads. In providing first adhesive members, at least a portion of a top surface of each of the plurality of bumps is exposed between the first adhesive members.

公开(公告)号：US20210094238A1

公开(公告)日：2021-04-01

申请号：US16886993

申请日：2020-05-29

Applicant: Samsung Display Co., Ltd.

Inventor： Hyun a LEE ,  Chan-Jae PARK ,  Heeju WOO ,  Kikyung YOUK ,  Sangduk LEE ,  Daehwan JANG

IPC: B29C65/08 ,  H05K3/30

Abstract: An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.

公开(公告)号：US20230403895A1

公开(公告)日：2023-12-14

申请号：US18202187

申请日：2023-05-25

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Youngok PARK ,  Seungsoo RYU ,  Heeju WOO

IPC: H10K59/131 ,  G09G3/3233 ,  H10K59/12

CPC classification number: H10K59/131 ,  G09G3/3233 ,  H10K59/1201 ,  G09G2300/0842

Abstract: A method of manufacturing a display apparatus in which the occurrence of a short circuit may be reduced includes forming a pad in a peripheral area of a substrate having a display area and the peripheral area outside the display area, disposing a first conductive particle on a surface of the pad, disposing a second conductive particle on a surface of a bump included in an electronic chip package, the surface of the bump facing the surface of the pad, and electrically connecting the pad to the bump by bringing the first conductive particle into contact with the second conductive particle.