公开(公告)号：US10671112B2

公开(公告)日：2020-06-02

申请号：US16541904

申请日：2019-08-15

Applicant: Samsung Display Co., Ltd.

Inventor： Whee-Won Lee ,  Ji Young Eom

IPC: G06F1/08 ,  G09G3/20 ,  H03C3/09

Abstract: A gate driving circuit includes a pull-up control part for applying a first previous carry signal to a first node in response to the first previous carry signal, a first pull-up part outputting a clock signal as an N-th gate output signal in response to a signal applied to the first node, a second pull-up part outputting the clock signal as the N-th gate output signal in response to the signal applied to the first node, a carry part outputting the clock signal as an N-th carry signal in response to the signal applied to the first node, a first pull-down part pulling down the signal at the first node to a second off voltage, and a second pull-down part pulling down the N-th gate output signal to a first off voltage, wherein one of the first pull-up part and the second pull-up part is selectively activated.

公开(公告)号：US10049611B2

公开(公告)日：2018-08-14

申请号：US15152697

申请日：2016-05-12

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Ji Young Eom ,  Bo-Ram Kang

IPC: G09G3/20 ,  G02F1/133 ,  G02F1/1333 ,  G02F1/1345 ,  H01L23/00 ,  H01L25/18 ,  H01L27/32 ,  H01L51/00

Abstract: A display apparatus includes a display panel and a display panel driver. The display panel driver includes a controller and a driver including a plurality of driving chips. Each of the driving chips includes a chip body, a plurality of input terminals, a plurality of first output terminals and a plurality of second output terminals. The chip body includes a bottom surface, a first side surface connected to the bottom surface and a second side surface opposite. The input terminals are disposed at a first region of the bottom surface adjacent to the first side surface of the chip body. The first output terminals are disposed at a second region of the bottom surface adjacent to the second side surface of the chip body. The second output terminals are disposed at a third region of the bottom surface adjacent to the first side surface of the chip body.