ELECTRONIC DEVICE AND METHOD OF BONDING THE SAME
    1.
    发明申请
    ELECTRONIC DEVICE AND METHOD OF BONDING THE SAME 有权
    电子设备及其结合方法

    公开(公告)号:US20160212823A1

    公开(公告)日:2016-07-21

    申请号:US14944765

    申请日:2015-11-18

    CPC classification number: H05B33/22 H05B33/06 H05B33/10 H05B33/145

    Abstract: An electronic device including a first electronic component including a first pad unit, a second electronic component electrically connected to the first electronic component, the second electronic component including a second pad unit connected to the first pad unit, and a conductive adhesion film that couples the first pad unit to the second pad unit. The conductive adhesion film includes an adhesion resin layer, a conductive ball dispersed in the adhesion resin layer, and a curing agent capsule dispersed in the adhesion resin layer, the curing agent capsule including a curing initiator and a tube that seals the curing initiator.

    Abstract translation: 一种电子设备,包括第一电子部件,所述第一电子部件包括第一焊盘单元,电连接到所述第一电子部件的第二电子部件,所述第二电子部件包括连接到所述第一焊盘单元的第二焊盘单元,以及导电粘合膜, 第一垫单元到第二垫单元。 导电粘合膜包括粘合树脂层,分散在粘合树脂层中的导电球和分散在粘合树脂层中的固化剂胶囊,固化剂胶囊包括固化引发剂和密封固化引发剂的管。

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