ELECTRONIC PANEL AND ELECTRONIC DEVICE HAVING THE SAME

    公开(公告)号:US20230232668A1

    公开(公告)日:2023-07-20

    申请号:US18151461

    申请日:2023-01-08

    CPC classification number: H10K59/124 G06F3/041 H10K50/844 H10K59/40 H10K59/131

    Abstract: An electronic panel including a display panel and an input sensor which includes a base layer, a first sensing electrode, a first signal line electrically connected to the first sensing electrode, a first insulating layer overlapping the first sensing electrode, a second sensing electrode, a second signal line electrically connected to the second sensing electrode, and a second insulating layer overlapping the second sensing electrode, in which the first insulating layer includes an open edge that defines an open area, the open area exposes a portion of a first surface of the base layer and a portion of the first signal line in a plan view, and the first insulating layer has a first thickness at a first point spaced apart from the open edge and a second thickness greater than the first thickness at a second point disposed farther away from the open edge than the first point.

    DISPLAY DEVICE
    2.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20190319078A1

    公开(公告)日:2019-10-17

    申请号:US16259523

    申请日:2019-01-28

    Abstract: A display device may include a display panel including a substrate that includes a display area and a pad area adjacent to the display area, and a first pad and a second pad on the pad area of the substrate, and a chip-on-film package over the pad area of the substrate with the first pad and the second pad in between, the chip-on-film package including an insulation layer, a first wiring on an upper surface of the insulation layer and electrically connected to the first pad, and a second wiring on a lower surface of the insulation layer and electrically connected to the second pad. A first signal having alternating voltage levels may be applied to the first wiring, and a second signal having a constant voltage level may be applied to the second wiring.

    DISPLAY DEVICE
    3.
    发明申请

    公开(公告)号:US20210351245A1

    公开(公告)日:2021-11-11

    申请号:US17380074

    申请日:2021-07-20

    Abstract: A display device may include a display panel including a substrate that includes a display area and a pad area adjacent to the display area, and a first pad and a second pad on the pad area of the substrate, and a chip-on-film package over the pad area of the substrate with the first pad and the second pad in between, the chip-on-film package including an insulation layer, a first wiring on an upper surface of the insulation layer and electrically connected to the first pad, and a second wiring on a lower surface of the insulation layer and electrically connected to the second pad. A first signal having alternating voltage levels may be applied to the first wiring, and a second signal having a constant voltage level may be applied to the second wiring.

    ELECTRONIC PANEL AND ELECTRONIC DEVICE HAVING THE SAME

    公开(公告)号:US20210005690A1

    公开(公告)日:2021-01-07

    申请号:US16905831

    申请日:2020-06-18

    Abstract: An electronic panel including a base layer, a signal line disposed on the base layer, and an insulating layer disposed on the base layer and including an open edge that contacts the signal line and defines an open area, the open area exposing a portion of the base layer and an end portion of the signal line when viewed in a plan view, in which the insulating layer has a first thickness at a first point spaced apart from the open edge, and a second thickness greater than the first thickness at a second point disposed farther away from the open edge than the first point.

    DISPLAY DEVICE
    5.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20200335556A1

    公开(公告)日:2020-10-22

    申请号:US16899698

    申请日:2020-06-12

    Abstract: A display device may include a display panel including a substrate that includes a display area and a pad area adjacent to the display area, and a first pad and a second pad on the pad area of the substrate, and a chip-on-film package over the pad area of the substrate with the first pad and the second pad in between, the chip-on-film package including an insulation layer, a first wiring on an upper surface of the insulation layer and electrically connected to the first pad, and a second wiring on a lower surface of the insulation layer and electrically connected to the second pad. A first signal having alternating voltage levels may be applied to the first wiring, and a second signal having a constant voltage level may be applied to the second wiring.

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