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公开(公告)号:US20250098129A1
公开(公告)日:2025-03-20
申请号:US18970131
申请日:2024-12-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangmin YE , Byunggun CHOI , Kwanhee HAN
Abstract: A speaker module includes a speaker housing including a first speaker housing defining at least one first surface of the speaker module and a second speaker housing defining at least one second surface of the speaker module that is opposite to the least one first surface, a speaker assembly including a voice coil and a vibration member, the speaker assembly being accommodated in an interior of the speaker housing, a back volume in an interior of the speaker housing and defined by the first speaker housing and the second speaker housing, and a side surface shield member between an inner surface of the speaker assembly and the back volume, the side surface shield member including a ferrite-based magnetic substance, where at least one vent hole communicating the speaker assembly and the back volume is in the side surface shield member.
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公开(公告)号:US20220417650A1
公开(公告)日:2022-12-29
申请号:US17817305
申请日:2022-08-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byunggun CHOI , Sangmin YE , Sangmin BAEK , Changi PARK
Abstract: In various example embodiments, an electronic device 300 may include: a housing 310 including a first housing 311 facing a first direction, and a second housing 312 facing a second direction opposite to the first direction; a sound module 340 disposed on a surface of the first housing 311 facing the second direction and configured to generate a sound; an acoustic duct 350 formed in the first housing 311 such that the sound module 340 and an outside of the electronic device 300 communicate with each other, and configured to transmit the sound generated by the sound module 340 to the outside of the electronic device 300; and a resonance structure 360 formed in the first housing 311 to communicate with the acoustic duct 350 to tune a resonance characteristic according to a shape of the acoustic duct 350.
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公开(公告)号:US20220004353A1
公开(公告)日:2022-01-06
申请号:US17480678
申请日:2021-09-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byunggun CHOI , Minseok LEE
Abstract: An electronic device, according to various embodiments, comprises: a connector configured to removably couple with a plug of an external audio device; a data signal line connected to at least one pin of the connector; and a processor, wherein the processor may be configured to identify a connection of the plug of the external audio device; and receive, through the data signal line, an audio signal from a codec connected to an antenna signal receiver in the external audio device. Additional various embodiments can be provided.
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公开(公告)号:US20230057510A1
公开(公告)日:2023-02-23
申请号:US17888817
申请日:2022-08-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jihoon PARK , Hanbom PARK , Byunggun CHOI
Abstract: An electronic device according to various embodiments of the disclosure includes: a first housing; a second housing configured to be unfolded by a specified angle with respect to the first housing and to rotate about a folding axis; at least one hinge structure including a hinge providing the folding axis and disposed between the first housing and the second housing to rotatably connect the first housing and the second housing; a hinge cover accommodating at least a portion of the hinge structure therein and selectively exposed based on the rotation of the second housing; a first speaker module including a speaker accommodated in the first housing; and a second speaker module including a speaker accommodated in the second housing, wherein in the first state, the first speaker module is configured to discharge sound to the outside of the electronic device via a first area provided in the first housing, a second area provided in the hinge structure and contact with the first area, and a first through-hole extending through the hinge cover, is exposed to the outside in the first state, and is configured to be selectively closed based on the rotation of the second housing.
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公开(公告)号:US20240121333A1
公开(公告)日:2024-04-11
申请号:US18477803
申请日:2023-09-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byunggun CHOI , Younseob SEO
IPC: H04M1/60 , G10L15/02 , G10L19/005 , G10L19/012 , G10L25/78 , H04R25/00
CPC classification number: H04M1/6041 , G10L15/02 , G10L19/005 , G10L19/012 , G10L25/78 , H04R25/554
Abstract: An electronic device according to an embodiment of the disclosure includes: a microphone, a communication module including a first communication circuit configured to provide a call channel with a first external electronic device and a second communication circuit configured to provide a communication channel with a second external electronic device, a processor electrically connected with the communication module. The processor is configured to: allow the electronic device operating in a first transmission mode and the first external electronic device to establish a call connection with each other through the first communication circuit, identify whether there is an utterance of a user wearing the second external electronic device, while the call connection is maintained, and operate in a second transmission mode different from the first transmission mode, based on a voice signal of the user to be transmitted to the first external electronic device not being recognized, while the call connection is maintained, and operate in the first transmission mode, based on the voice signal of the user to be transmitted to the first external electronic device being recognized, while the call connection is maintained.
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公开(公告)号:US20220329937A1
公开(公告)日:2022-10-13
申请号:US17715822
申请日:2022-04-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanhee HAN , Byunggun CHOI , Sangmin YE
Abstract: According to various embodiments of the disclosure, an electronic device may include a housing, a speaker module disposed inside the housing, a printed circuit board disposed within the housing and including a power transmission line configured to supply power to an electronic component of the electronic device, and a loop line extending from the power transmission line toward the speaker module.
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