公开(公告)号：US20220076931A1

公开(公告)日：2022-03-10

申请号：US17528321

申请日：2021-11-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Siqing Lu ,  Cheonkyu LEE ,  Takafumi Noguchi

IPC: H01J37/32 ,  H01L21/67 ,  C23C14/54 ,  C23C16/46 ,  C23C16/458

Abstract: A plasma processing apparatus includes a process chamber, a substrate support chuck configured to support a substrate in the process chamber, the substrate support chuck including an upper cooling channel and a lower cooling channel that are symmetrically separated from each other, and a support chuck temperature controller configured to supply a first coolant to the upper cooling channel and to supply a second coolant to the lower cooling channel.

公开(公告)号：US20200176230A1

公开(公告)日：2020-06-04

申请号：US16454105

申请日：2019-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Siqing Lu ,  Cheonkyu LEE ,  Takafumi Noguchi

IPC: H01J37/32 ,  H01L21/67

Abstract: A plasma processing apparatus includes a process chamber, a substrate support chuck configured to support a substrate in the process chamber, the substrate support chuck including an upper cooling channel and a lower cooling channel that are symmetrically separated from each other, and a support chuck temperature controller configured to supply a first coolant to the upper cooling channel and to supply a second coolant to the lower cooling channel.

公开(公告)号：US20200066557A1

公开(公告)日：2020-02-27

申请号：US16385919

申请日：2019-04-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheonkyu LEE ,  Siqing LU ,  Takafumi NOGUCHI

IPC: H01L21/67 ,  H01L21/683 ,  H05K7/20

Abstract: A plasma processing apparatus includes a process chamber, a substrate chuck disposed in the process chamber, and a temperature controller. The substrate chuck is configured to receive a substrate, and includes a cooling channel through which a coolant flows. The temperature controller is configured to control a temperature of the coolant supplied to the cooling channel. The temperature controller includes a cooler configured to cool the coolant supplied to the cooling channel, a heater configured to heat the coolant supplied to the cooling channel, and a 3-way valve configured to regulate a first flow rate of the coolant passing through the cooler and a second flow rate of the coolant passing through the heater.