WEARABLE ELECTRONIC DEVICE COMPRISING FASTENING STRUCTURE

    公开(公告)号:US20230255326A1

    公开(公告)日:2023-08-17

    申请号:US18298683

    申请日:2023-04-11

    CPC classification number: A44C5/14 G04G17/00

    Abstract: A wearable electronic device according to an embodiment of the present disclosure comprises: a display that forms a front surface of the wearable electronic device; and a frame part that surrounds the display and forms at least a part of the exterior of the wearable electronic device, wherein the frame part comprises a fastening part to which a strap for assisting wearing of the wearable electronic device is coupled, the fastening part comprises a first coupling part, and a second coupling part spaced apart from the first coupling part by a specified distance, the first coupling part comprises a first groove into which a fastening structure of the strap can be inserted, and a second groove to which the fastening structure of the strap can be fixed, the second coupling part comprises a fourth groove to which the fastening structure of the strap can be fixed, and the fastening structure of the strap may be at least inserted into the first groove and fixed to the second groove and the fourth groove. According to various embodiments of the present disclosure, since a guide groove is provided in a fastening part of a frame part of a wearable electronic device, a user can easily fasten a strap without determining an exact position thereof, and it is possible to prevent and/or reduce damage to the wearable device or the strap that occurs in the process of determining the exact position of a hole provided in the wearable electronic device.

    ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE

    公开(公告)号:US20210321540A1

    公开(公告)日:2021-10-14

    申请号:US17266355

    申请日:2019-06-24

    Abstract: An electronic device according to various embodiments of the disclosure includes: a housing including a plurality of acoustic holes; an enclosure mounted in the housing; at least one heating element disposed in the enclosure; a heat dissipation structure disposed on the heating element to transfer heat generated from the heating element; and a heat dissipation duct disposed at least partially on the heat dissipation structure to provide a path for transferring the heat transferred from the heat dissipation structure to the outside through the acoustic holes. The heat dissipation structure may include: at least one first heat transfer member coupled to the one heating element; and a second heat transfer member disposed at least partially on the first heat transfer member to transfer, to the heat dissipation duct, heat transferred from the first heat transfer member.

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