公开(公告)号：US10484347B2

公开(公告)日：2019-11-19

申请号：US15205727

申请日：2016-07-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bo Seong Kim ,  Dong Hoon Kang ,  Jin Seok Kang ,  Min Kyun Kim ,  Su Jeong Yoon ,  Jae Young Lee ,  Nam In Kim ,  Beom Jun Lee ,  Sung Mi Lee ,  Hyeong Seok Lee ,  Ye Seul Han

IPC: H04L29/06 ,  H04L9/08 ,  H04L12/58 ,  H04W4/12 ,  H04W12/02 ,  H04W12/00

Abstract: An electronic device is provided. The electronic device includes a processor, and a memory configured to store a messenger application, wherein the processor is configured to output the messenger application on the display and output a list of chat rooms joined based on a first user account on the display, and wherein the list of the plurality of chat rooms comprises a first chat room, in which the electronic device participates, and a second chat room in which another electronic device participates.

公开(公告)号：US12002827B2

公开(公告)日：2024-06-04

申请号：US17398503

申请日：2021-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Hoon Kang

IPC: H01L21/00 ,  H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14645 ,  H01L27/14683

Abstract: An image sensor package includes: an image sensor chip that includes first and second faces that are opposite to each other and includes side walls that connect the first and second faces; a mold layer disposed on the side walls of the image sensor chip and that includes third and fourth faces that are opposite to each other; a transparent substrate disposed on the second face of the image sensor chip and spaced apart from the image sensor chip in a first direction, the transparent substrate including a first portion that overlaps the image sensor chip in the first direction and a second portion that does not overlap the image sensor chip in the first direction; and an adhesive layer disposed between the mold layer and the second portion of the transparent substrate, wherein the side walls of the image sensor chip overlap the mold layer in a second direction intersecting the first direction and the fourth face of the mold layer does not overlap the image sensor chip in the first direction.

公开(公告)号：US10567696B2

公开(公告)日：2020-02-18

申请号：US16198405

申请日：2018-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Yeon Park ,  Ji Eun Park ,  Dong Hoon Kang ,  Jin Hwa Jang

IPC: H04N5/50 ,  H04N5/445

Abstract: A broadcast receiving for updating service map information by scanning the broadcast signal when signaling information included in a broadcast signal has been changed.

公开(公告)号：US20190065031A1

公开(公告)日：2019-02-28

申请号：US16107414

申请日：2018-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Kwang Kang ,  Dong Hoon Kang ,  Byung Woo Min ,  Jae Min Yoo ,  Kyu Hong Kim ,  Jong Wu Baek

IPC: G06F3/0481 ,  G06F3/0488 ,  G06F3/0482

Abstract: An electronic device is provided. The electronic device includes a display, a processor, and a memory storing a first application program including a first user interface and a second application program including a second user interface. The memory stores instructions that, when executed, cause the processor to display an array of icons in an area adjacent to the edge in response to the gesture input, wherein each of the icons has a first size, one of the icons includes a first icon and a second icon, the first icon and second icon having a second size smaller than the first size, the first icon indicates the first application program, and the second icon indicates the second application program, receive an input to select the one of the icons, and display the first user interface and the second user interface together on the display in response to the received input.