公开(公告)号：US10448528B2

公开(公告)日：2019-10-15

申请号：US15603896

申请日：2017-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Hyeon Hwang ,  Sung Jin Park ,  Byoung Ju Ahn ,  Kwang Youn Lee ,  Young Jin Yi

IPC: H05K7/14 ,  G06F1/16 ,  H05K5/02 ,  C23C16/44 ,  H05K5/00 ,  C25D11/12

Abstract: A housing of an electronic device is provided. The housing includes a first surface, a second surface, a side surface surrounding at least a portion of a space formed between the first surface and the second surface, a first surface layer formed by applying a first texture and a first color to a first area of at least one of the first surface, the second surface, and the side surface of the housing, and a second surface layer formed by applying a second texture and a second color to a second area within the first area, wherein at least one of the first surface layer and the second surface layer includes an oxide film layer.