公开(公告)号：US11624545B2

公开(公告)日：2023-04-11

申请号：US16721040

申请日：2019-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Jin Park ,  Dong Won Koo ,  In Yong Hwang ,  Youn Tae Shin ,  Dong Hyun Lee

IPC: F25D17/08 ,  F25D23/00 ,  F25D23/12 ,  F25D27/00 ,  F25D29/00 ,  F25D11/02

Abstract: A refrigerator includes a cabinet, a cooling module including a compressor, a condenser, an expansion valve, and an evaporator, and attachable to or detachable from the cabinet so that the cooling module is removably mounted to the cabinet, an electronic device arranged in the cabinet, and an electrical box configured to be electrically connected to the electronic device and the compressor, receive power from outside and supply the received power to the electronic device and the compressor.

公开(公告)号：US11009287B2

公开(公告)日：2021-05-18

申请号：US16321161

申请日：2017-07-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Mo Kim ,  Po Cheon Kim ,  Dong Won Koo ,  Woo Chul Cho ,  Sun Hwan Joo ,  Oun Gu Lee

IPC: F25D23/04 ,  F25D23/02 ,  F25D29/00 ,  F25D11/02

Abstract: The refrigerator includes a main body having a storage room, a door for opening and closing the storage room, and a camera device having a plurality of cameras for photographing the storage room and mounted on the inner surface of the door. The state of the storage room can be checked without opening the door by the camera device.

公开(公告)号：US10760848B2

公开(公告)日：2020-09-01

申请号：US16250384

申请日：2019-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Won Koo ,  Sung Mo Kim ,  Po Cheon Kim ,  Sang Cheol Lee ,  Oun Gu Lee ,  Woo Chul Cho ,  Sun Hwan Joo

IPC: F25D23/00 ,  F25D23/02 ,  H05K7/20 ,  F25D29/00 ,  F25D23/06 ,  F25D27/00

Abstract: Provided herein is a refrigerator with an improved coupling structure of a heat dissipation duct for dissipating heat generated in a display unit and having and applying the improved heat dissipation duct to a door having a thin thickness such that a problem in which a curve is generated at an exterior of a door when an inside of the door is filled with a heat insulating material is prevented. The refrigerator includes a main body, and a door, wherein the door includes a door cap coupled to at least one of an upper portion and a lower portion of the door, a display unit provided at a front surface of the door, a heat dissipation cover arranged behind the display unit, and a heat dissipation duct slidably inserted into the door through the at least one of the upper portion and the lower portion of the door.

公开(公告)号：US10215472B2

公开(公告)日：2019-02-26

申请号：US15955440

申请日：2018-04-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Won Koo ,  Sung Mo Kim ,  Po Cheon Kim ,  Sang Cheol Lee ,  Oun Gu Lee ,  Woo Chul Cho ,  Sun Hwan Joo

IPC: F25D23/00 ,  F25D23/02 ,  H05K7/20 ,  F25D23/06 ,  F25D27/00 ,  F25D29/00

Abstract: Provided herein is a refrigerator with an improved coupling structure of a heat dissipation duct for dissipating heat generated in a display unit and having and applying the improved heat dissipation duct to a door having a thin thickness such that a problem in which a curve is generated at an exterior of a door when an inside of the door is filled with a heat insulating material is prevented. The refrigerator includes a main body, and a door, wherein the door includes a door cap coupled to at least one of an upper portion and a lower portion of the door, a display unit provided at a front surface of the door, a heat dissipation cover arranged behind the display unit, and a heat dissipation duct slidably inserted into the door through the at least one of the upper portion and the lower portion of the door.