公开(公告)号：US20200236796A1

公开(公告)日：2020-07-23

申请号：US16655938

申请日：2019-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hangyu HWANG ,  Changsu KIM ,  Dukjin KIM ,  Sooyoung KIM ,  Jongyoul NOH ,  Sangsik NA ,  Jongbae JEON ,  Rathore Pranveer SINGH ,  Ingook HONG

IPC: H05K5/00 ,  B29C45/27

Abstract: An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing in a direction opposite to that of the first plate, and a side member enclosing a space between the first plate and the second plate and formed with a method of solidifying a resin including a predetermined amount of rigidity reinforcing material injected into an injection mold and including a plurality of side surfaces, and a gate mark receiving portion formed in each of the plurality of side surfaces of the side member and configured to receive at least one gate mark according to separation of the injection mold. The gate mark receiving portion is formed by a processing portion disposed at a corresponding position inside a cavity of the injection mold.