公开(公告)号：US10354967B2

公开(公告)日：2019-07-16

申请号：US15456882

申请日：2017-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-woo Kim ,  Woon-bae Kim ,  Bo-in Noh ,  Go-woon Seong ,  Ji-yong Park

IPC: H01L23/48 ,  H01L21/44 ,  H01L23/00

Abstract: A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.