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公开(公告)号：US10937738B2
公开(公告)日：2021-03-02
申请号：US14991800
申请日：2016-01-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： O-hyun Beak , Keon Kuk , Young-chul Ko , Woon-bae Kim
IPC: H01L23/552 , H04W4/50 , H01L23/29 , B05C5/00 , B05C5/02 , H01L21/02 , H01L21/3205 , H01L21/67 , H01L23/48 , H01L23/00 , H05K1/18 , H01L23/31 , H01L25/10 , H01L21/56 , H01L25/065
Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.
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2.发明申请公开(公告)号：US20180012069A1
公开(公告)日：2018-01-11
申请号：US15638660
申请日：2017-06-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dae-young Chung , Hee-chang Hwang , Kun-yong Yoon , Woon-bae Kim , Bum-suk Kim , Min Jang , Min-chul Lee , Jung-woo Kim
IPC: G06K9/00
CPC classification number: G06K9/00563 , A61B5/1172 , G06K9/00013 , G06K9/0004 , G06K9/00046 , G06K9/00053 , G06K9/00087 , G06K9/0012 , G06K9/2036 , G06K9/24
Abstract: At least some example embodiments provide a fingerprint sensor, a fingerprint sensor package, and a fingerprint sensing system using light sources of a display panel. The fingerprint sensor includes an image sensor including a plurality of sensor pixels, the sensor pixels configured to sense light reflected by a fingerprint and generate image information corresponding to the fingerprint and a pinhole mask defining a plurality of pinholes, wherein each of the pinholes forms a focus for transmitting the light reflected by the fingerprint to the image sensor, wherein light is emitted from a plurality of organic light-emitting diodes (OLEDs) and is reflected by the fingerprint.
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公开(公告)号：US20130303909A1
公开(公告)日：2013-11-14
申请号：US13886792
申请日：2013-05-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sung-Chan KANG , Woon-bae Kim , Jong-seok Kim , Yong-seop Yoon
IPC: A61B5/00
CPC classification number: A61B5/0095 , A61B5/0035 , A61B8/4483 , G01N29/2418 , G01N2291/02475 , G10K15/046
Abstract: Laser-induced ultrasonic wave apparatuses and methods of generating images using the same. The laser-induced ultrasonic wave apparatus includes a laser source which irradiates a laser beam to a target object and a thermoelastic material; a thermoelastic material which converts the laser beam to a first ultrasonic wave and irradiates the first ultrasonic wave to the target object; and a receiving unit which receives an echo acoustic wave of the first ultrasonic wave and receives a second ultrasonic wave generated by the target object due to the laser beam.
Abstract translation: 激光诱导超声波装置及使用其的图像生成方法。 激光感应超声波装置包括将激光束照射到目标物体的激光源和热弹性材料; 将激光束转换为第一超声波并将第一超声波照射到目标物体的热弹性材料; 以及接收单元，其接收第一超声波的回波声波并且接收由于激光束而由目标对象产生的第二超声波。
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公开(公告)号：US11721640B2
公开(公告)日：2023-08-08
申请号：US17543920
申请日：2021-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jun-gu Kang , Young-mok Kim , Woon-bae Kim , Dae-cheol Seong , Yune-seok Chung
IPC: H01L23/552 , H01L23/48 , H01L23/00 , H01L21/74 , H01L27/12
CPC classification number: H01L23/552 , H01L21/743 , H01L23/481 , H01L24/05 , H01L24/06 , H01L24/14 , H01L27/1203 , H01L2224/0401 , H01L2224/0557 , H01L2224/09103 , H01L2224/1403
Abstract: An integrated circuit chip includes an SOI substrate having a structure in which a bulk substrate, a buried insulating film, and a semiconductor body layer are sequentially stacked, a conductive ion implantation region formed at a position adjacent to the buried insulating film in the bulk substrate, an integrated circuit portion formed on an active surface of the semiconductor body layer, and a penetrating electrode portion arranged at a position spaced apart from the integrated circuit portion in a horizontal direction, the penetrating electrode portion penetrating the semiconductor body layer and the buried insulating layer in a vertical direction, and the penetrating electrode portion connected to the conductive ion implantation region. An integrated circuit package and a display device include the integrated circuit chip.
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公开(公告)号：US11222853B2
公开(公告)日：2022-01-11
申请号：US16589589
申请日：2019-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jun-gu Kang , Young-mok Kim , Woon-bae Kim , Dae-cheol Seong , Yune-seok Chung
IPC: H01L23/552 , H01L23/48 , H01L23/00 , H01L21/74 , H01L27/12
Abstract: An integrated circuit chip includes an SOI substrate having a structure in which a bulk substrate, a buried insulating film, and a semiconductor body layer are sequentially stacked, a conductive ion implantation region formed at a position adjacent to the buried insulating film in the bulk substrate, an integrated circuit portion formed on an active surface of the semiconductor body layer, and a penetrating electrode portion arranged at a position spaced apart from the integrated circuit portion in a horizontal direction, the penetrating electrode portion penetrating the semiconductor body layer and the buried insulating layer in a vertical direction, and the penetrating electrode portion connected to the conductive ion implantation region. An integrated circuit package and a display device include the integrated circuit chip.
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Patent Agency Ranking
公开(公告)号：US10349835B2
公开(公告)日：2019-07-16
申请号：US14475072
申请日：2014-09-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung-wan Lee , Woon-bae Kim , Eun-sung Lee , Jong-hyeon Chang , Min-seog Choi , Hyun Choi
Abstract: Provided are an optical switch, an optical probe including the optical switch, and a medical imaging apparatus including the optical probe. The optical probe includes a probe body that is configured to be insertable into a body cavity, and an optical switch that is disposed in the probe body and includes a first region formed of a material having a first refractive index, and a second region that forms an interface with the first region and is configured to have a fluid is introduced into the second region, wherein the optical switch is configured to change a path of propagation of incident light according to a second refractive index of the second region.
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公开(公告)号：US09529241B2
公开(公告)日：2016-12-27
申请号：US13855288
申请日：2013-04-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jong-hyeon Chang , Woon-bae Kim , Seung-wan Lee , Eun-sung Lee , Kyu-dong Jung , Min-seog Choi
CPC classification number: G02F1/167 , G02B3/14 , G02B5/005 , G02B26/005
Abstract: A microfluidic device and a method of controlling a fluid included in the microfluidic device. The microfluidic device includes: a chamber; a first fluid that is disposed in the chamber and in which a hygroscopic material is dissolved; a second fluid that is disposed in the chamber and is immiscible with the first fluid; and an electrode portion provide in the chamber and is configured to form an electrical field in the chamber when a voltage is applied to the electrode portion, wherein an interface between the first and second fluids is varied according to the electrical field.
Abstract translation: 微流体装置和控制包括在微流体装置中的流体的方法。 微流体装置包括：腔室; 设置在所述室中并且其中吸湿材料溶解的第一流体; 第二流体，其设置在所述室中并与所述第一流体不混溶; 并且电极部分提供在腔室中并且被配置为当电压施加到电极部分时在腔室中形成电场，其中第一和第二流体之间的界面根据电场而变化。
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公开(公告)号：US09445063B2
公开(公告)日：2016-09-13
申请号：US14178835
申请日：2014-02-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Woon-bae Kim
CPC classification number: H04N9/3129 , G02B26/103 , G03B21/2033 , H04N9/3173
Abstract: A fiber scanning projector includes a light source comprising a plurality of monochromatic light sources, a modulator providing a modulation signal according to image information to the light source, a scanner scanning a screen with a light emitted from the light source and controlled according to the modulation signal, the scanner including a fiber bundle and an actuator which 2-axis-drives the fiber bundle, and a synchronization controller synchronizing driving of the actuator and driving of the modulator.
Abstract translation: 一种光纤扫描投影仪，包括：多个单色光源的光源;根据图像信息向光源提供调制信号的调制器;扫描器，用光源发出的光进行扫描，并根据调制 信号，扫描仪包括光纤束和驱动光纤束的致动器，同步控制器同步驱动致动器和驱动调制器。
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公开(公告)号：US09151945B2
公开(公告)日：2015-10-06
申请号：US14474991
申请日：2014-09-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jong-hyeon Chang , Woon-bae Kim , Seung-wan Lee , Eun-sung Lee , Min-seog Choi
CPC classification number: G02B26/004 , G02B26/005 , G03B9/02 , H04N5/2354 , H04N5/238
Abstract: Provided are a micro electric liquid device and an apparatus including the device. The micro electric liquid device includes a first fluid that is opaque, a second fluid that is transparent a first channel configured to have the first and second fluid flow therein without mixing, a second channel overlapped and spaced apart from the first channel, wherein the second channel is configured to have the first and second fluids flow therein, and a connection part connecting the first and second channels, wherein an aperture is adjusted by a positional change of an interface between the first and second fluids in the first and second channels, and wherein the second channel includes a first sub channel configured to have the first and second fluids flow therein and having a non-uniform height and a second sub channel configured to have the second fluid to flow therein and having a uniform height.
Abstract translation: 提供了一种微电液装置和包括该装置的装置。 所述微电液体装置包括不透明的第一流体，透明的第二流体，所述第一流体被构造成使得所述第一和第二流体在其中不混合地流动，第二通道与所述第一通道重叠并间隔开，其中所述第二流体 通道被配置成使第一和第二流体流入其中，以及连接部分，其连接第一和第二通道，其中通过第一和第二通道中的第一和第二流体之间的界面的位置变化来调整孔径，以及 其中所述第二通道包括构造成使所述第一和第二流体在其中流动并具有不均匀高度的第一子通道，以及构造成使所述第二流体在其中流动并且具有均匀高度的第二子通道。
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公开(公告)号：US09978674B2
公开(公告)日：2018-05-22
申请号：US15479856
申请日：2017-04-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung-woo Kim , Jae-min Jung , Ji-yong Park , Jeong-kyu Ha , Woon-bae Kim
IPC: H01L33/48 , H01L23/498 , H01L23/00 , H01L23/29 , H01L23/488 , H01L33/62
CPC classification number: H01L23/4985 , H01L23/29 , H01L23/488 , H01L23/4922 , H01L24/29 , H01L24/32 , H01L25/167 , H01L33/48 , H01L33/62 , H01L2924/143 , H01L2924/186
Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
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