公开(公告)号：US12244327B2

公开(公告)日：2025-03-04

申请号：US18601237

申请日：2024-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoondo Lee ,  Sigwan Kim ,  Hyelee Song ,  Dongryul Shin ,  Dongmin Shin ,  Yoonjae Lee ,  Handug Lee ,  Woosik Cho ,  Weonjai Choi ,  Taewook Ham ,  Kyunggu Kim ,  Hongpyo Bae ,  Jinwoo Jung ,  Youngjun Cho

IPC: H01Q1/08 ,  H01Q1/24 ,  H01Q5/50 ,  H01Q21/08 ,  H04B1/00 ,  H05K1/02 ,  H05K7/14

Abstract: In embodiments, an electronic device may include a housing having an inner space, a printed circuit board (PCB) disposed in the inner space of the housing, a first antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a first frequency band, at least one second antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a second frequency band different from the first frequency band, and a flexible substrate electrically connecting the PCB and the first antenna structure. The flexible substrate may include a first connecting portion electrically connected to the PCB, an interconnecting portion extended from the first connecting portion to the first antenna structure, at least one branch portion branched from at least a part of the interconnecting portion, and extended to the at least one second antenna structure, at least one first conductive path disposed in the interconnecting portion, and electrically connecting the first connecting portion and the first antenna structure, and at least one second conductive path disposed in the interconnecting portion and the at least one branch portion, and electrically connecting the first connecting portion and the at least one second antenna structure.

公开(公告)号：US11929768B2

公开(公告)日：2024-03-12

申请号：US16976907

申请日：2020-07-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoondo Lee ,  Sigwan Kim ,  Hyelee Song ,  Dongryul Shin ,  Dongmin Shin ,  Yoonjae Lee ,  Handug Lee ,  Woosik Cho ,  Weonjai Choi ,  Taewook Ham ,  Kyunggu Kim ,  Hongpyo Bae ,  Jinwoo Jung ,  Youngjun Cho

IPC: H01Q1/50 ,  H01Q1/24 ,  H01Q5/50 ,  H01Q21/08 ,  H04B1/00 ,  H05K1/02 ,  H05K7/14

CPC classification number: H04B1/0064 ,  H01Q1/243 ,  H01Q5/50 ,  H01Q21/08 ,  H05K1/0243 ,  H05K1/0277 ,  H05K7/1427 ,  H05K2201/10098

Abstract: In embodiments, an electronic device may include a housing having an inner space, a printed circuit board (PCB) disposed in the inner space of the housing, a first antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a first frequency band, at least one second antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a second frequency band different from the first frequency band, and a flexible substrate electrically connecting the PCB and the first antenna structure. The flexible substrate may include a first connecting portion electrically connected to the PCB, an interconnecting portion extended from the first connecting portion to the first antenna structure, at least one branch portion branched from at least a part of the interconnecting portion, and extended to the at least one second antenna structure, at least one first conductive path disposed in the interconnecting portion, and electrically connecting the first connecting portion and the first antenna structure, and at least one second conductive path disposed in the interconnecting portion and the at least one branch portion, and electrically connecting the first connecting portion and the at least one second antenna structure.

公开(公告)号：US11848500B2

公开(公告)日：2023-12-19

申请号：US16941643

申请日：2020-07-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junghwan Yeom ,  Youngjong Kim ,  Sungwon Park ,  Handug Lee ,  Jongwoo Choi

IPC: H01Q1/24 ,  H01Q21/06 ,  H01Q21/00

CPC classification number: H01Q21/065 ,  H01Q1/243 ,  H01Q21/0025

Abstract: Disclosed is an electronic device. The electronic device includes: a housing including at least a part of a lateral surface of the electronic device; a printed circuit board (PCB) disposed in the housing; at least one wireless communication circuit disposed on the PCB; a first antenna module including at least one antenna disposed in a first region inside the housing; a second antenna module including at least one antenna disposed in a second region inside the housing; a third antenna module including at least one antenna disposed in a third region inside the housing; a first flexible printed circuit board (FPCB) connecting the first antenna module to the at least one wireless communication circuit; and a second FPCB connecting the second antenna module and the third antenna module to the at least one wireless communication circuit. The second FPCB includes: a first connector disposed on the PCB and electrically connected to the wireless communication circuit; a second connector coupled to a second joint electrically connected to the second antenna module; a third connector coupled to a third joint electrically connected to the third antenna module; and a coupler connecting the first connector, the second connector, and the third connector.