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公开(公告)号：US12244327B2
公开(公告)日：2025-03-04
申请号：US18601237
申请日：2024-03-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yoondo Lee , Sigwan Kim , Hyelee Song , Dongryul Shin , Dongmin Shin , Yoonjae Lee , Handug Lee , Woosik Cho , Weonjai Choi , Taewook Ham , Kyunggu Kim , Hongpyo Bae , Jinwoo Jung , Youngjun Cho
Abstract: In embodiments, an electronic device may include a housing having an inner space, a printed circuit board (PCB) disposed in the inner space of the housing, a first antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a first frequency band, at least one second antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a second frequency band different from the first frequency band, and a flexible substrate electrically connecting the PCB and the first antenna structure. The flexible substrate may include a first connecting portion electrically connected to the PCB, an interconnecting portion extended from the first connecting portion to the first antenna structure, at least one branch portion branched from at least a part of the interconnecting portion, and extended to the at least one second antenna structure, at least one first conductive path disposed in the interconnecting portion, and electrically connecting the first connecting portion and the first antenna structure, and at least one second conductive path disposed in the interconnecting portion and the at least one branch portion, and electrically connecting the first connecting portion and the at least one second antenna structure.
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2.发明授权公开(公告)号：US11963112B2
公开(公告)日：2024-04-16
申请号：US17309146
申请日：2019-10-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Woosik Cho
CPC classification number: H04W52/52 , H03F1/56 , H03F7/00 , H04W52/226 , H03F2200/451
Abstract: Various embodiments of the present invention relate to an electronic device and a method for controlling transmission power, the electronic device comprising: an amplification circuit; an antenna electrically connected to the amplification circuit; a variable element capable of adjusting the impedance between the amplification circuit and the antenna; and a control circuit, wherein the control circuit can be configured to: output a signal, having been amplified by a designated gain by means of the amplification circuit, to an external electronic device by using the antenna, in a state in which the variable element is adjusted to a first impedance; detect the approach of an external object during outputting of the signal; in response to the detection of the approach of the external object, check control information by which the first impedance of the variable element can be changed to a second impedance; and adjust the designated gain on the basis of at least the control information.
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3.发明授权公开(公告)号：US11191032B2
公开(公告)日：2021-11-30
申请号：US16936217
申请日：2020-07-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Woosik Cho , Kyungrok Lee , Hyeongjoo Oh , Minhwan Jeon , Daeyoung Jo , Kwan Heo , Wonhyung Heo
Abstract: An electronic device includes a first antenna that transmits/receives a signal in a first frequency band, a second antenna that transmits/receives a signal in a second frequency band, a first wireless communication circuit connected with the first antenna, a second wireless communication circuit connected with the second antenna, at least one processor connected with the first and second wireless communication circuits, and a memory. The memory stores instructions that cause the processor to output a first signal with a first power to control the first wireless communication circuit to output the first signal through the first antenna, and output the first signal with a power, which is obtained by backing off from the first power as much as a first backoff value, to control the second wireless communication circuit to output a second signal through the second antenna while controlling the first wireless communication circuit to output the first signal.
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公开(公告)号：US11963290B2
公开(公告)日：2024-04-16
申请号：US17855931
申请日：2022-07-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongwoo Choi , Seunghwa Shin , Kyungrok Lee , Woosik Cho
IPC: H05K1/02
CPC classification number: H05K1/0237 , H05K1/0209 , H05K2201/10098 , H05K2201/10181
Abstract: According to certain embodiments, an electronic device comprises: a housing; an electronic component disposed in the housing, wherein the electronic component generates heat during operation; a support cover disposed on the electronic component; a metal member overlapping with the electronic component while interposing the support cover between the metal member and the electronic component; a switching unit selectively forming or disconnecting an electrical connection path of the support cover and the metal member; and at least one processor configured to select an antenna tuning code, based at least in part on whether the switching unit forms or disconnects the electrical connection path, wherein the switching unit includes: a receiving member electrically connected to the support cover and providing a receiving space; a thermally deforming member received in the receiving space, wherein the thermally deforming member deforms based on a temperature; and an elevating member configured to move upwardly to electrically connect the metal member to the support cover, when the thermally deforming member deforms.
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Patent Agency Ranking
公开(公告)号：US11929768B2
公开(公告)日：2024-03-12
申请号：US16976907
申请日：2020-07-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yoondo Lee , Sigwan Kim , Hyelee Song , Dongryul Shin , Dongmin Shin , Yoonjae Lee , Handug Lee , Woosik Cho , Weonjai Choi , Taewook Ham , Kyunggu Kim , Hongpyo Bae , Jinwoo Jung , Youngjun Cho
CPC classification number: H04B1/0064 , H01Q1/243 , H01Q5/50 , H01Q21/08 , H05K1/0243 , H05K1/0277 , H05K7/1427 , H05K2201/10098
Abstract: In embodiments, an electronic device may include a housing having an inner space, a printed circuit board (PCB) disposed in the inner space of the housing, a first antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a first frequency band, at least one second antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a second frequency band different from the first frequency band, and a flexible substrate electrically connecting the PCB and the first antenna structure. The flexible substrate may include a first connecting portion electrically connected to the PCB, an interconnecting portion extended from the first connecting portion to the first antenna structure, at least one branch portion branched from at least a part of the interconnecting portion, and extended to the at least one second antenna structure, at least one first conductive path disposed in the interconnecting portion, and electrically connecting the first connecting portion and the first antenna structure, and at least one second conductive path disposed in the interconnecting portion and the at least one branch portion, and electrically connecting the first connecting portion and the at least one second antenna structure.
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公开(公告)号：US11316284B2
公开(公告)日：2022-04-26
申请号：US17036313
申请日：2020-09-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Woosik Cho , Dowan Kim , Yongsang Yun , Kyungrok Lee , Sunghyup Lee , Wonhyung Heo
Abstract: An electronic device includes: a housing including a front plate, a rear plate disposed opposite the front plate, and a side bezel enclosing at least a portion of a space between the front plate and the rear plate; a display disposed in the space and visible through at least a portion of the front plate, wherein the display includes a first layer including a plurality of pixels; and a second layer disposed at the first layer and including an opening; and an antenna module disposed in the space, wherein the antenna module includes a printed circuit board including a first surface facing away from the first layer through the opening and a second surface facing opposite the first surface; at least one antenna element disposed on the first surface, or inside the printed circuit board closer to the first surface than the second surface; and a communication circuit disposed at the second surface of the printed circuit board, the communication circuit configured to transmit and/or receive signals of a selected or designated frequency band through the at least one antenna element.
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公开(公告)号：US12081292B2
公开(公告)日：2024-09-03
申请号：US17863973
申请日：2022-07-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Woosik Cho , Kyubin Kang , Seunggil Jeon
IPC: H04B7/0426 , H01Q1/24 , H04B7/06 , H04M1/02
CPC classification number: H04B7/043 , H01Q1/241 , H04B7/0602 , H04M1/021
Abstract: An electronic device is provided. The electronic device includes a hinge module, a first housing at least partially coupled to a first side of the hinge module and including a first antenna, a second housing at least partially coupled to a second side of the hinge module, configured to be foldable and unfoldable with the first housing by using the hinge module, and including a second antenna, a sensor circuit configured to detect an unfolding state and/or a folding state of the first housing and the second housing, a processor operatively connected to the first antenna, the second antenna, and the sensor circuit, a first signal line configured to connect the processor and the first antenna, a tuner circuit disposed on the first signal line, and a second signal line configured to connect the processor and the second antenna, wherein the processor is configured to, in case that the first housing and the second housing are detected to be in the folding state by using the sensor circuit, receive feedback of a signal transmitted to the second antenna, detect a phase of the feedback signal, and determine a time constant of the tuner circuit disposed on the first signal line, based on the detected phase of the signal.
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公开(公告)号：US11204624B2
公开(公告)日：2021-12-21
申请号：US16943016
申请日：2020-07-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Woosik Cho , Taewon Kim
Abstract: An electronic device is provided, which includes a first housing, a second housing, a hinge structure, a flexible display configured to form a front surface of the first housing and the second housing while the electronic device is in an unfolded state, a first support member disposed between the flexible display and the first housing, a first bimetal member disposed between the flexible display and the first support member, a first magnet disposed between the flexible display and the first bimetal member, and a second magnet disposed between the flexible display and the second housing. The first bimetal member has a first length at a first temperature and a second length longer than the first length at a second temperature higher than the first temperature. The first support member has a reception space having a length greater than or equal to the first length and less than the second length that provides space for the first bimetal member to bend at the second temperature.
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公开(公告)号：US20210034102A1
公开(公告)日：2021-02-04
申请号：US16943016
申请日：2020-07-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Woosik Cho , Taewon Kim
Abstract: An electronic device is provided, which includes a first housing, a second housing, a hinge structure, a flexible display configured to form a front surface of the first housing and the second housing while the electronic device is in an unfolded state, a first support member disposed between the flexible display and the first housing, a first bimetal member disposed between the flexible display and the first support member, a first magnet disposed between the flexible display and the first bimetal member, and a second magnet disposed between the flexible display and the second housing. The first bimetal member has a first length at a first temperature and a second length longer than the first length at a second temperature higher than the first temperature. The first support member has a reception space having a length greater than or equal to the first length and less than the second length that provides space for the first bimetal member to bend at the second temperature.
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