公开(公告)号：US11612066B2

公开(公告)日：2023-03-21

申请号：US17301845

申请日：2021-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghyun Im ,  Hyosang Lim ,  Heekwang Lim ,  Seungchang Baek ,  Hyeongsam Son ,  Sungho Cho ,  Hangyu Hwang ,  Jongchul Choi

IPC: H05K5/02 ,  H05K5/00

Abstract: An electronic device includes a front plate, a back plate that faces away from the front plate, a display, a frame, a polymer member, and an adhesive layer. The display is disposed between the front plate and the back plate and visible through the front plate. The frame surrounds an interior space between the front plate and the back plate and formed of a metallic material. The frame includes a first metal part and a second metal part. The polymer member is coupled to the frame and contains a polymer material. The adhesive layer bonds the polymer member and the frame. The frame includes an opening formed in a first part thereof. The opening is formed through the first metal part and being formed to a specified depth through the second metal part. The polymer member forms at least part of an inner surface of the opening.

公开(公告)号：US12283978B2

公开(公告)日：2025-04-22

申请号：US17548036

申请日：2021-12-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyosang Lim ,  Heekwang Lim ,  Sangsik Na ,  Hyeonseok Yoon ,  Changsu Kim

IPC: H04B1/03 ,  H01Q1/24 ,  H01Q1/38 ,  H04B1/034 ,  H05K5/00

Abstract: Disclosed is a portable communication device including a housing, a printed circuit board seated in the housing and mounted to a communication circuit, and a least one position adjusting groove, wherein the housing includes a support plate having at least one antenna unit operatively connected with the communication circuit, and an injection molded member surrounding at least a portion of the at least one antenna unit, wherein the support plate includes a main body in which at least a portion of the printed circuit board is seated, and at least one lead connecting the at least one antenna unit with the main body, and wherein the at least one position adjusting groove is formed at a position at which the at least one lead makes contact with the injection molded member.