公开(公告)号：US20170150657A1

公开(公告)日：2017-05-25

申请号：US15271620

申请日：2016-09-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Min SEO ,  Jun-Taek OH ,  Jin-Woo KIM ,  So-Young LEE

IPC: H05K9/00 ,  H05K1/14 ,  H05K1/02 ,  H05K7/14 ,  H05K1/18

CPC classification number: H05K9/0026 ,  H05K1/028 ,  H05K1/14 ,  H05K1/181 ,  H05K7/1427 ,  H05K9/0032 ,  H05K2201/10522

Abstract: A shield structure including a metallic plate that is disposed between the first electronic component and the second electronic component; a first side wall that encloses at least a portion of the first electronic component, and includes a first portion that is formed by a portion that extends from the peripheral edge of the metallic plate and is formed by being bent in the first direction; and a second side wall that encloses at least a portion the second electronic component, and includes a second portion that is formed by a portion that extends from the peripheral edge of the metallic plate and is formed by being bent in the second direction.

公开(公告)号：US20150288113A1

公开(公告)日：2015-10-08

申请号：US14640742

申请日：2015-03-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Min SEO ,  Yong-Yi KIM

IPC: H01R24/50 ,  H01R12/71

CPC classification number: H01R13/7039 ,  H01R12/716 ,  H01R13/703 ,  H01R13/7031 ,  H01R2103/00

Abstract: An electronic device is provided. The electronic device includes a connection member mounted on a circuit board and a first connector coupled to the connection member, in which a signal terminal of the first connector is electrically connected to the circuit board through the connection member, and a ground terminal of the first connector is connected to a ground of the circuit board. The electronic device may be implemented variously.

Abstract translation: 提供电子设备。 电子设备包括安装在电路板上的连接构件和耦合到连接构件的第一连接器，其中第一连接器的信号端子通过连接构件与电路板电连接，第一连接构件的接地端子 连接器连接到电路板的接地。 电子设备可以被不同地实现。