公开(公告)号：US20240357746A1

公开(公告)日：2024-10-24

申请号：US18326031

申请日：2023-05-31

Applicant: INNODISK CORPORATION

Inventor： CHIH-CHIEH KAO

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10628

Abstract: A high capacitance module for electrically connecting to a second circuit board comprises a first circuit board provided with a plurality of metal contacts and at least one capacitor core arranged on the first circuit board. The capacitor cores have connection pins that are electrically connected to the metal contacts through conductive glue. An adhesive layer covers the capacitor cores. The capacitor cores are electrically connected to a memory module arranged on the second circuit board.

公开(公告)号：US12108563B2

公开(公告)日：2024-10-01

申请号：US17874462

申请日：2022-07-27

Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

Inventor： Feng Zhou ,  Hiroshi Ukegawa

IPC: H05K7/20 ,  H01L23/373 ,  H01L23/473 ,  H01L23/538 ,  H01L25/07 ,  H05K1/18

CPC classification number: H05K7/20254 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/5383 ,  H01L23/5389 ,  H01L25/072 ,  H05K1/185 ,  H05K7/20927 ,  H05K2201/10166 ,  H05K2201/10522

Abstract: Power electronics assemblies having embedded power electronics devices are disclosed. In one embodiment, a power electronics assembly includes a circuit board assembly that includes a substrate that is electrically insulating and a power electronics device assembly embedded in the substrate. The power electronics device assembly includes an S-cell that includes an inner graphite layer, a metal layer encasing the inner graphite layer, and a first surface of the metal layer comprising a recess provided within the first surface. The power electronics device assembly further includes a power electronics device disposed within the recess of the first surface.

公开(公告)号：US20240306304A1

公开(公告)日：2024-09-12

申请号：US18441334

申请日：2024-02-14

Applicant: HYUNDAI MOBIS CO., LTD.

Inventor： Chan Yang CHOE ,  Min Ki KIM

IPC: H05K1/18 ,  H01L21/48 ,  H01L23/498 ,  H01L23/64 ,  H05K3/00 ,  H05K3/06

CPC classification number: H05K1/181 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/647 ,  H05K3/0073 ,  H05K3/06 ,  H05K2201/10022 ,  H05K2201/10522 ,  H05K2203/0323 ,  H05K2203/1316

Abstract: An apparatus and method for manufacturing a power module is provided. The power module includes: a circuit board having a metal pattern formed thereon; a terminal coupled to the circuit board and electrically connected to at least a portion of the metal pattern; a power device chip bonded to the circuit board and electrically connected to at least a portion of the metal pattern and the terminal; and a molding part covering the power device chip and the circuit board. The circuit board includes: a base part comprising an insulating material; a pattern layer disposed on at least one of an upper surface and a lower surface of the base part and providing the metal pattern; and a thin film resistor having a predetermined circuit pattern connecting the metal patterns disposed on the base part to each other.

公开(公告)号：US12080634B2

公开(公告)日：2024-09-03

申请号：US17756556

申请日：2020-11-25

Applicant: THE NOCO COMPANY

Inventor： James P. McBride ,  James Richard Stanfield

IPC: H05K1/18 ,  H01L23/495 ,  H01M10/42 ,  H01M50/519 ,  H05K1/14 ,  H05K3/34 ,  H01L25/11

CPC classification number: H01L23/49555 ,  H01L23/49562 ,  H01M10/4257 ,  H01M50/519 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3426 ,  H01L25/115 ,  H01M2010/4271 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10659 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2203/049

Abstract: Provided is a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device including a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).

公开(公告)号：US20240250524A1

公开(公告)日：2024-07-25

申请号：US18418135

申请日：2024-01-19

Applicant: Proterial, Ltd.

Inventor： Haruyasu KOMANO

IPC: H02H9/04 ,  H01C1/16 ,  H05K1/16 ,  H05K1/18

CPC classification number: H02H9/044 ,  H01C1/16 ,  H05K1/167 ,  H05K1/18 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10522

Abstract: A surge suppression device is provided with a resistor, and a capacitor electrically connected to the resistor. The resistor includes a substrate and a resistive-conducting layer composed of a sintered resistive paste provided on the substrate.

公开(公告)号：US12022619B2

公开(公告)日：2024-06-25

申请号：US18309413

申请日：2023-04-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-Hyun Seok ,  Gyu Chae Lee ,  Jeong Hyeon Cho

IPC: H05K1/18 ,  H01L25/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01L25/18 ,  H05K1/117 ,  H05K2201/09227 ,  H05K2201/09509 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10734

Abstract: A semiconductor chip module includes a PCB including first and second faces; a buffer on the first face; a first chip on the first face, and including a first connection terminal and a second connection terminal, a first signal being provided to the first connection terminal, and a second signal being provided to the second connection terminal; a second chip on the second face, and including a third connection terminal to which the first signal is provided, and a fourth connection terminal to which the second signal is provided. The first connection terminal and the third connection terminal receive the first signal from the buffer at the same time. The first connection terminal is closer to the buffer as compared with the second connection terminal. The third connection terminal is closer to the buffer as compared with the fourth connection terminal.

公开(公告)号：US20240194390A1

公开(公告)日：2024-06-13

申请号：US18444674

申请日：2024-02-17

Applicant: Delta Electronics, Inc.

Inventor： Yahong Xiong ,  Da Jin ,  Qinghua Su

IPC: H01F27/28 ,  G05F1/575 ,  G06F1/18 ,  H01F17/04 ,  H01F17/06 ,  H01F27/02 ,  H01F27/24 ,  H01F27/29 ,  H01L25/16 ,  H01R12/52 ,  H01R12/58 ,  H02M3/00 ,  H02M3/158 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K3/28 ,  H05K7/14 ,  H05K7/20

CPC classification number: H01F27/2804 ,  G05F1/575 ,  G06F1/183 ,  H01F17/04 ,  H01F17/06 ,  H01F27/02 ,  H01F27/24 ,  H01F27/292 ,  H01L25/16 ,  H01R12/52 ,  H01R12/58 ,  H02M3/003 ,  H02M3/1584 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/117 ,  H05K1/145 ,  H05K1/165 ,  H05K1/181 ,  H05K1/186 ,  H05K3/284 ,  H05K7/1427 ,  H05K7/2089 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2201/10984

Abstract: An apparatus includes a heat-dissipating substrate, a power circuit and a magnetic assembly. The heat-dissipating substrate includes a thermal contact surface. The power circuit includes at least one switch element in contact with the thermal contact surface of the heat-dissipating substrate. The magnetic assembly includes at least one first electrical conductor and a magnetic core module comprising at least one hole, wherein the at least one first electrical conductor passes through the at least one hole, and a terminal of the at least one first electrical conductor is electrically connected to the at least one switch element. The heat-dissipating substrate, the power circuit and the magnetic assembly are arranged in sequence along a same direction. A projection of the power circuit on the thermal contact surface partially overlaps a projection of the magnetic assembly on the thermal contact surface.

公开(公告)号：US20240170472A1

公开(公告)日：2024-05-23

申请号：US18551305

申请日：2022-03-17

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Akira HARAGUCHI

IPC: H01L25/18 ,  H05K1/18 ,  H05K7/20

CPC classification number: H01L25/18 ,  H05K1/18 ,  H05K7/20418 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10272 ,  H05K2201/10522

Abstract: A first heat dissipation member is thermally connected to a first busbar. A second heat dissipation member is thermally connected to a second busbar. The first busbar and the second busbar respectively have a first facing part and a second facing part that face each other. The first facing part has a first surface on which a first electronic component is mounted and a second surface opposite to the first surface. The second facing part has a third surface that faces the second surface and a fourth surface that is positioned opposite to the third surface and on which a second electronic component is mounted. A circuit board has a wiring board that is positioned behind the first facing part and is positioned in front of the second facing part when the second facing part side is seen from the first facing part side.

公开(公告)号：US11973414B2

公开(公告)日：2024-04-30

申请号：US17159927

申请日：2021-01-27

Applicant: SCHNEIDER ELECTRIC IT CORPORATION

Inventor： Indra Prakash ,  Roger Franchino ,  Damir Klikic

IPC: H02M1/08 ,  H02M7/00 ,  H02M7/537 ,  H05K1/02 ,  H05K1/18 ,  H05K3/32

CPC classification number: H02M1/08 ,  H02M7/003 ,  H02M7/537 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/32 ,  H05K2201/09227 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10522

Abstract: According to one aspect, embodiments of the invention provide an electrical-converter system comprising a printed circuit board including at least a first layer and a second layer, a switching node disposed on the second layer, a first transistor, a second transistor, a third transistor, and a fourth transistor disposed on the first layer, a first conduction path from a source of the first transistor, through the switching node, to a drain of the fourth transistor, the first conduction path having a first length, and a second conduction path from the source of the first transistor, through the switching node, to a drain of the second transistor, the second conduction path having a second length, wherein the first length of the first conduction path is greater than the second length of the second conduction path.

公开(公告)号：US20240128773A1

公开(公告)日：2024-04-18

申请号：US18392924

申请日：2023-12-21

Applicant: MILWAUKEE ELECTRIC TOOL CORPORATION

Inventor： Wyatt R. Silha ,  Cameron R. Schulz ,  Kyle C. Fassbender ,  Zhi Wei Meng

IPC: H02J7/00 ,  H01M10/44 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC classification number: H02J7/0042 ,  H01M10/44 ,  H02J7/00047 ,  H02J7/0013 ,  H02J7/00309 ,  H02J7/0045 ,  H02J7/0047 ,  H05K1/0295 ,  H05K1/18 ,  H05K7/20154 ,  H05K7/20209 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10522

Abstract: A battery charger may include a printed circuit board (PCB) having a first portion supporting alternating current (AC) electrical components and a second portion supporting direct current (DC) electrical components; an indicator including a light-emitting diode (LED) supported on the first portion of the PCB and operable to emit light; and an isolating member positioned on the first portion between the AC electrical components and the LED. A trace on the PCB may be electrically connected to the second portion of the PCB, the trace extending from the second portion and along the first portion, and the LED may be electrically connected to and receiving DC power through the trace, the LED being selectively positioned along a length of the trace. The LED may be positioned more than about 8 mm from the AC electrical components.