公开(公告)号：US20240360958A1

公开(公告)日：2024-10-31

申请号：US18766179

申请日：2024-07-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunchul CHO ,  Jaehyo JEONG ,  Yonghwa CHOI ,  Taewook KANG

IPC: F17C7/00 ,  F28F99/00

CPC classification number: F17C7/00 ,  F17C2205/0311 ,  F28F99/00

Abstract: A gas injection device according to an example includes a support portion having a first sidewall extending at a first slope, a sealing cap including an elastic material and having a second sidewall extending at a second slope, and a pipe connection portion having a conduit shape including a through-hole extending in a first direction, the pipe connection portion having one end portion connected to one end portion of the sealing cap, wherein the first sidewall and the second sidewall are arranged to face each other, and a first inclination angle formed by the first direction and the first sidewall is greater than a second inclination angle formed by the first direction and the second sidewall.

公开(公告)号：US20240118045A1

公开(公告)日：2024-04-11

申请号：US18228440

申请日：2023-07-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunchul CHO ,  Kangtae SEO ,  Jeungku CHOI ,  Yonghwa CHOI

IPC: F28F9/02 ,  F28F9/18

CPC classification number: F28F9/0256 ,  F28F9/18 ,  F28F2275/04 ,  F28F2275/06

Abstract: A heat exchanger including a heat exchange fin; a refrigerant pipe passing through the heat exchange fin, the refrigerant pipe having a first thickness; a connecting member coupled to the refrigerant pipe; and a distribution pipe coupled to the connecting member at an outside of the heat exchange fin, the distribution pipe having a second thickness greater than the first thickness, wherein the connecting member is positioned between the refrigerant pipe and the distribution pipe so that a refrigerant is flowable through the connecting member between the refrigerant pipe and the distribution pipe, and has a thickness in a range of 95% or more and 105% or less of the second thickness.