公开(公告)号：US20160341796A1

公开(公告)日：2016-11-24

申请号：US15161839

申请日：2016-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunho BAEK

IPC: G01R31/3187 ,  G01R31/40

CPC classification number: G01R31/40 ,  G01R29/26 ,  G01R31/44

Abstract: Disclosed is an inspection apparatus for inspecting a chip for noise, including an inspection circuit that is connected to a first power line of the chip and that receives a signal to be inspected, wherein the first voltage is applied to the first power line and the signal to be inspected includes noise having a second voltage, and a voltage doubler that is connected to the first power line and boosts a voltage of driving power having the first voltage, wherein the inspection circuit may be driven by the driving power, the voltage of the driving power is boosted by the voltage doubler, and the inspection circuit inspects the chip for the noise of the signal to be inspected.

Abstract translation: 公开了一种用于检查噪声芯片的检查装置，包括连接到芯片的第一电力线并接收待检查信号的检查电路，其中第一电压施加到第一电力线和信号 被检查包括具有第二电压的噪声，以及连接到第一电力线的升压器，并且提升具有第一电压的驱动电压的电压，其中检查电路可以由驱动电力驱动， 驱动功率由倍压器提升，检查电路检查芯片是否检测到信号的噪声。

公开(公告)号：US20190386378A1

公开(公告)日：2019-12-19

申请号：US16440058

申请日：2019-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho LEE ,  Hyunho BAEK

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q5/30 ,  H01L23/66 ,  H01L23/498 ,  H01L23/14 ,  H01L23/48

Abstract: An electronic device and an antenna device of an electronic device are provided. The electronic device includes a wafer, a radio frequency integrated circuit (RFIC) fabricated in the wafer, an antenna interposer disposed on a surface of the wafer, an antenna structure fabricated in the antenna interposer, the antenna structure comprising a first conductive pattern with a first electrical length and a second conductive pattern with a second electrical length, a switch formed in the RFIC and electrically connected to at least one of the first conductive pattern or the second conductive pattern based on a frequency band of a signal being transmitted or received by the RFIC, and a through hole formed in at least part of the wafer or the antenna interposer and electrically connecting the RFIC and the antenna structure.