Semiconductor package
    2.
    发明授权

    公开(公告)号:US10971426B2

    公开(公告)日:2021-04-06

    申请号:US16411191

    申请日:2019-05-14

    Inventor: Jae Wook Yoo

    Abstract: A semiconductor package is provided. The semiconductor package includes a first package comprising a first substrate and a first semiconductor chip, a second package arranged on the first package, and the second package comprising a second substrate and a second semiconductor chip, a first solder ball and a supporter layer arranged between the first package and the second package, and a dam arranged between the first package and the second package, the dam being in contact with a sidewall of the supporter layer, and the dam completely surrounding the sidewall of the supporter layer.

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